Protective Sheet Resin Layer for Clean Glass and Wafer Dicing
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Solution Overview
Problem
The existing methods for dividing semiconductor wafers and glass plates into individual components often result in minute foreign matters being generated, which adhere to the surfaces of electronic components and glass pieces, leading to operational reliability issues, bonding defects, and impaired transmittance, affecting the quality of images and displays.
Innovation Solution
A protective sheet with a water-soluble or curable resin composition is applied to the surfaces of electronic components and glass pieces to prevent minute foreign matters from adhering during the division process, featuring a protective layer that can be easily removed after processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing is used to divide semiconductor wafers and glass plates into individual components, then productivity is improved, but minute foreign matters are generated that adhere to surfaces, worsening reliability and manufacturing precision
Solution Approach 1:
A protective sheet is applied to the surface of the semiconductor wafer or glass plate before the dicing process. This protective sheet prevents minute foreign matters generated during dicing from adhering to the surface, thereby maintaining reliability and manufacturing precision while still allowing efficient division into individual components.
2Productivity
If dicing is used to divide semiconductor wafers and glass plates into individual components, then productivity is improved, but manufacturing precision deteriorates due to surface contamination
Solution Approach 1:
A protective sheet is applied to the surface of the semiconductor wafer or glass plate before the dicing process. This protective sheet prevents minute foreign matters generated during dicing from adhering to the surface, thereby maintaining reliability and manufacturing precision while still allowing efficient division into individual components.
3Reliability
If a protective sheet is applied to prevent foreign matter adherence, then reliability is improved, but device complexity increases
Solution Approach 1:
The protective sheet is designed as a disposable component that is applied before dicing and then discarded after the process. This simple, single-use approach maintains reliability by preventing foreign matter adherence without requiring complex removal mechanisms or adding permanent complexity to the device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective sheet effectively suppresses the adherence of minute foreign matters, enhancing the operational reliability of electronic components and maintaining the transmittance of glass pieces, ensuring clear images and displays by preventing damage during the division process.
Implementation Method 1
the protective layer is made of a water-soluble resin composition
Implementation Method 2
the protective layer is made of a curable resin composition with its adhesiveness reducible by curing reaction
Data Source
AI summary
A protective sheet according to the present invention is a protective sheet for being attached to a protected surface of an electronic component having the protected surface, one surface of a glass piece forming a display surface of a display apparatus, or one surface of a glass plate for obtaining the glass piece. The protective sheet includes a protective layer for being attached to the protected surface of the electronic component, the one surface of the glass piece, or the one surface of the glass plate. The protective layer is made of one of a water-soluble resin composition and a curable resin composition with its adhesiveness reducible by curing reaction.