Protective Tape Adhesiveness Control for Shield Layer Formation

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Solution Overview

Problem

The adhesion of metallic powder to protective tapes during the processing of semiconductor packages can lead to abnormal electric discharge during plasma treatment, hindering the formation of a shield layer and reducing quality.

Innovation Solution

A package substrate processing method that reduces or eliminates the adhesiveness of the protective tape's adhesive layer, using techniques such as UV ray application or water-soluble resin application, to prevent metallic powder adhesion and enable effective plasma treatment for shield layer formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the protective tape maintains high adhesiveness to support the package substrate, then the substrate can be properly held during processing, but metallic powder adheres to the adhesive layer causing abnormal electric discharge during plasma treatment

Engineering Contradiction:

Improveadhesiveness of protective tapeVSAvoidabnormal electric discharge during plasma treatment

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The protective tape is divided into two functional regions: an adhesive region that maintains strong adhesion to the package substrate, and a non-adhesive region in the periphery that prevents metallic powder adhesion. This segmentation allows the tape to simultaneously provide substrate support while preventing harmful powder accumulation during plasma treatment.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the protective tape are given different adhesive properties. The central region maintains high adhesiveness for substrate support, while the peripheral region has reduced adhesiveness to prevent metallic powder adhesion. This local differentiation resolves the contradiction between needing strong adhesion and preventing powder accumulation.

Inventive Principle:

Principle #3Local quality

2Loss of substance

If metallic powder adheres to the protective tape during dividing, then the tape can collect scattered powder, but abnormal electric discharge occurs during subsequent plasma treatment

Engineering Contradiction:

Improvemetallic powder scatteringVSAvoidplasma treatment quality

Core Design Contradiction:

Loss of substanceVSReliability

Solution Approach 1:

The harmful function of the adhesive layer (collecting metallic powder) is extracted and eliminated from the peripheral region of the protective tape. By removing the adhesive property from the periphery, metallic powder is prevented from adhering there, thus eliminating the source of abnormal electric discharge during plasma treatment while maintaining substrate support in the central region.

Inventive Principle:

Principle #2Taking out (Extraction)

3Manufacturing precision

If the protective tape is replaced to prevent powder adhesion, then plasma treatment quality is maintained, but production costs increase and package intervals are disrupted

Engineering Contradiction:

Improveshield layer formation qualityVSAvoidproduction efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The protective tape is designed to perform multiple functions simultaneously: it provides substrate support through adhesion in the central region, and prevents metallic powder adhesion through the non-adhesive peripheral region. This multi-functionality eliminates the need for tape replacement between dividing and plasma treatment operations, maintaining both quality and productivity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The protective tape is pre-configured with differentiated adhesive regions before use. The non-adhesive peripheral region is prepared in advance to prevent metallic powder adhesion, eliminating the need for subsequent tape replacement operations and ensuring continuous production efficiency.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method prevents abnormal electric discharge and allows for the successful formation of a shield layer on semiconductor packages, improving the quality and reducing the need for tape replacement, thereby reducing costs and maintaining package intervals.

Implementation Method 1

applying UV rays to the adhesive layer exposed in the periphery of the package substrate, to reduce adhesion of the metallic powder to the adhesive layer of the protective tape

Methodology Applied

Scientific EffectUV ray application: Photopolymerisation

Data Source

PatentUS11183464B2Package substrate processing method and protective tape

Publication Date: 2021.11.23 DISCO CORP

AI summary

A package substrate processing method for processing a package substrate in which a plurality of semiconductor chips on a wiring substrate are collectively sealed with a sealing agent is provided. In the package substrate processing method, a protective tape is adhered to the wiring substrate side of the package substrate, the package substrate is divided into a plurality of semiconductor packages, and a shield layer is formed on an upper surface and side surfaces of each package. In this instance, the package substrate is divided in a state in which adhesiveness of an adhesive layer of the protective tape in the periphery of the package substrate is reduced or eliminated, whereby adhesion of a metallic powder scattering at the time of the dividing to the adhesive layer of the protective tape is restrained.