Protruding Alignment Patterns on Semiconductor Substrates
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving high performance and efficiency due to complex fabrication processes and limited integration capabilities, particularly in stacking multiple devices effectively.
Innovation Solution
The proposed solution involves a circuit board and semiconductor package design with a mother substrate featuring scribing regions, through vias, and protrusion patterns, allowing for simplified fabrication and efficient stacking of semiconductor chips, with alignment patterns aiding in precise alignment and integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex fabrication processes are used to achieve high performance semiconductor packages, then performance and efficiency improve, but manufacturing complexity and cost increase
Solution Approach 1:
Alignment patterns are formed on the substrate before chip stacking, enabling precise alignment to be established in advance. This preliminary alignment structure simplifies subsequent chip placement processes while ensuring high positioning accuracy for multi-chip stacking, resolving the contradiction between performance and fabrication complexity
Solution Approach 2:
The alignment pattern acts as an intermediary element between the substrate and stacked chips. This intermediate structure facilitates precise alignment without requiring complex alignment mechanisms, enabling high-performance multi-chip packages through a simplified fabrication process
2Productivity
If multiple devices are stacked to increase integration capability, then memory capacity and transmission rate improve, but alignment precision requirements increase
Solution Approach 1:
Alignment patterns are pre-formed on the substrate surface before chip stacking begins. These patterns serve as reference markers that enable precise alignment of multiple chips during the stacking process, allowing high integration capability to be achieved while maintaining manufacturing precision through a simplified alignment approach
3Ease of manufacture
If traditional alignment methods are used, then fabrication process remains simple, but alignment precision and stacking accuracy deteriorate
Solution Approach 1:
Alignment patterns are formed on the substrate in advance as a preliminary step before chip stacking. This pre-established alignment reference system maintains fabrication simplicity while dramatically improving alignment accuracy and stacking precision, resolving the contradiction between ease of manufacture and manufacturing precision
Solution Approach 2:
The alignment pattern serves as an intermediary reference structure that bridges the substrate and stacked chips. This intermediate element enables high precision alignment to be achieved without complicating the fabrication process, as the patterns provide clear visual or optical references for positioning
Data Source
AI summary
A circuit board comprises a mother substrate including first and second scribing regions, the first scribing region extending in first direction, the second scribing region extending in second direction, the first and second directions crossing each other, the mother substrate including chip regions defined by the first and second scribing regions, and a through via penetrating the chip regions of the mother substrate. The mother substrate comprises a first alignment pattern protruding from a top surface of the mother substrate. The first alignment pattern is disposed on at least one of the scribing regions.