Protruding Barrier Frame for EMI Shielding in Electronic Packages
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Solution Overview
Problem
Existing electronic packages fail to effectively prevent electromagnetic interference (EMI) between semiconductor chips, leading to signal errors.
Innovation Solution
An electronic package design featuring a barrier frame made of conductive material positioned between adjacent chips, with a portion protruding from the encapsulant to contact a shielding element, forming a shielding structure that prevents EMI between chips and external interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal film is formed on the encapsulant to protect RF chips from external EMI, then external EMI protection is improved, but EMI between adjacent RF chips cannot be prevented
Solution Approach 1:
The shielding structure is segmented into multiple parts: a barrier frame positioned between adjacent RF chips to block mutual EMI, and a metal film formed on the encapsulant for external EMI protection. This segmentation allows each component to address specific EMI sources independently, resolving the contradiction between protecting from external EMI and preventing inter-chip EMI.
2Object-affected harmful factors
If a barrier frame is added between adjacent electronic elements to prevent EMI, then EMI prevention is improved, but device complexity and fabrication difficulty increase
Solution Approach 1:
The barrier frame is merged with the encapsulant structure, where the barrier frame serves as an integral part of the packaging assembly. The frame is positioned between adjacent electronic elements and integrated into the encapsulation process, reducing overall device complexity while maintaining effective EMI prevention functionality.
3Stability of the object's composition
If the barrier frame is completely enclosed by the encapsulant, then encapsulation integrity is improved, but the shielding element cannot contact the barrier frame to form an effective shielding structure
Solution Approach 1:
The encapsulant is designed with different local qualities: most of the barrier frame is enclosed by the encapsulant to maintain structural integrity and protection, while a portion of the barrier frame remains exposed to allow contact with the shielding element. This local differentiation resolves the contradiction by providing both encapsulation integrity and shielding effectiveness in different regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents EMI between electronic elements and shields internal circuits from external interference, simplifying the fabrication process and reducing costs by eliminating the need for openings in the encapsulant and considering circuit arrangements.
Implementation Method 1
the shielding element and the portion of the barrier frame that protrudes from the encapsulant form a shielding structure around the electronic elements, thereby effectively preventing EMI from occurring between the electronic elements and also preventing external EMI from adversely affecting internal circuits of the electronic elements
Implementation Method 2
the shielding element is a conductive layer formed by sputtering on the encapsulant
Data Source
AI summary
An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a bather frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the bather frame with a portion of the bather frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the bather frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.