Protruding Base Member Insulation Distance in Semiconductor Devices
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Solution Overview
Problem
The second insulating layer in semiconductor devices is exposed, leading to lower reliability due to moisture absorption and thermal stress, compromising insulation properties.
Innovation Solution
A semiconductor device design featuring a conductor layer sandwiched between a first and second insulating layer, with a protruding portion on the base member extending towards the insulating member, ensuring a longer insulation distance and improved insulation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the second insulating layer is exposed to the outside of the metal base plate, then the insulation structure is simplified, but the reliability of insulation deteriorates due to moisture absorption and thermal stress
Solution Approach 1:
The invention extends the insulating member in the lateral direction beyond the peripheral edge of the metal base plate, creating an overlapping region. This dimensional extension allows the insulating member to be positioned in a space that provides both mechanical support and environmental protection, resolving the contradiction between structural simplicity and insulation reliability.
Solution Approach 2:
The insulating member is designed to extend laterally beyond the metal base plate before assembly is complete, creating a protective barrier in advance. This预先延伸的绝缘结构 cushions the conductive components from moisture and thermal stress before these harmful factors can cause damage, thereby improving insulation reliability without significantly increasing overall device complexity.
2Reliability
If the insulating member extends beyond the metal base plate, then insulation reliability improves, but device complexity increases
Solution Approach 1:
The insulating member is integrated with both the metal base plate and the conductive components, serving multiple functions simultaneously: electrical insulation, mechanical support, and environmental protection. This merging of functions reduces the need for separate protective components, thereby improving reliability without proportionally increasing device complexity.
Solution Approach 2:
The insulating member is designed as a multi-functional component that provides electrical insulation, structural support, and environmental sealing. By making the insulating member universal in its functionality, the invention achieves improved insulation reliability without adding numerous separate components, thus limiting the increase in device complexity.
3Length of stationary object
If a protruding portion is formed on the base member, then insulation distance increases, but manufacturing complexity increases
Solution Approach 1:
The protruding portion is incorporated into the base member during the initial forming process, rather than being added as a separate subsequent operation. This preliminary action allows the protruding portion to be created using standard forming techniques already part of the base member manufacturing process, thereby increasing insulation distance without significantly increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reliably secures insulation properties by reducing moisture absorption and thermal stress, enhancing the overall reliability of the semiconductor device.
Implementation Method 1
forms a capacitance circuit between the first insulating layer and the conductor plate, and forms a capacitance circuit between the second insulating layer and the base member
Data Source
AI summary
There is a problem that the reliability of insulation is lowered. A length L2 from a center P of a conductor layer 334 to a peripheral edge portion of an insulating member 333 is formed to be longer than a length L1 from the center P of the conductor layer 334 to a peripheral edge portion of a protruding portion 307a of a base member 307. In other words, a base end surface 308 of the peripheral edge portion of the protruding portion 307a is located on an inner side with respect to an insulating member end surface 336 of the peripheral edge portion of the insulating member 333. Further, the insulating member end surface 336 of the insulating member 333 and a conductor layer end surface 344 of the conductor layer form an end surface at the same position. Since the base end surface 308 of the peripheral edge portion of the protruding portion 307a is located on the inner side with respect to the insulating member end surface 336 of the peripheral edge portion of the insulating member 333 in this manner, an insulation distance can be secured.