Electronic Component Module Thermal Dissipation via Protruding Chip
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Solution Overview
Problem
In electronic component modules, heat generated by semiconductor chips can accumulate and cause noise in electrical characteristics and thermal fatigue, leading to potential failures, especially when a wireless function is integrated, making effective heat dissipation a design constraint for small, high-performance modules.
Innovation Solution
The electronic component module design includes a board with external terminals and semiconductor chips where the first semiconductor chip protrudes to contact a mounting board, allowing heat to be dissipated through a metal layer or heat dissipation pattern, and the second semiconductor chip is positioned to minimize heat conduction from the first chip, using a frame body and separation walls to further reduce heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor chips are mounted on the board to achieve high-performance electronic component module, then device functionality is improved, but heat accumulation occurs causing noise in electrical characteristics and thermal fatigue
Solution Approach 1:
The board is divided into multiple regions with different thermal conductivity characteristics. High-thermal-conductivity regions are positioned near heat-generating semiconductor chips, while low-thermal-conductivity regions are placed near sensitive components. This spatial segmentation of thermal pathways allows effective heat dissipation from chips while protecting sensitive areas from thermal interference.
Solution Approach 2:
Different regions of the board are assigned different thermal conductivity properties to meet local requirements. The region near semiconductor chips has high thermal conductivity for heat dissipation, while the region near wireless communication components has low thermal conductivity to prevent heat-induced noise. This local differentiation of thermal properties resolves the contradiction between enabling high-performance functionality and preventing heat accumulation.
2Temperature
If via holes are used for heat dissipation from power amplification devices, then heat dissipation is improved, but the structure becomes more complex
Solution Approach 1:
The heat dissipation function is merged with the existing board structure by utilizing the substrate itself as a thermal management component. Different regions of the board substrate are designed with different thermal conductivity values, combining the mechanical support function and thermal management function into a single integrated structure, thereby avoiding the need for separate via holes and reducing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from the first semiconductor chip, reducing the risk of thermal fatigue and failures, enabling the creation of small, thin, high-performance electronic component modules with integrated wireless functions.
Implementation Method 1
heat generated by the first semiconductor chip can be escaped to the mounting board side
Implementation Method 2
a metal layer or heat dissipation pattern enhancing heat escape
Data Source
AI summary
An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do.