Protruding Electrode Geometry for More Reliable Solder Joining
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Solution Overview
Problem
Existing electronic devices with solder layers between substrates face reliability issues due to insufficient joining, affecting the functionality of side walls and electrical connection members.
Innovation Solution
The electronic device member features a solder layer in contact with a tip surface of protruding portions, including side surfaces and a connection portion forming an obtuse angle, enhancing the joining reliability by allowing the solder to creep and cover a wider area, thereby improving the electrical connection between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the solder layer is used to join electrical connection members and side walls to substrates, then electrical connection is achieved, but joining reliability is insufficient
Solution Approach 1:
The patent changes the geometric parameters of the protruding portion by forming an obtuse angle between the side surface and tip surface, rather than using a conventional right angle or acute angle. This parameter change allows the solder layer to spread more effectively and creates a larger bonding area, thereby improving joining reliability and joint strength without changing the materials used.
2Reliability
If the solder layer has insufficient joining reliability, then electrical connection is achieved, but functionality of side walls and electrical connection members is affected
Solution Approach 1:
By modifying the angle parameter at the connection portion to be obtuse rather than right or acute, the solder layer achieves better wetting and adhesion. This prevents functionality degradation that would otherwise occur due to insufficient joining reliability, ensuring that both side walls and electrical connection members maintain their intended functions.
3Area of stationary object
If the solder layer is applied to a conventional protruding portion, then joining is achieved, but solder creep and coverage area are limited
Solution Approach 1:
The obtuse angle configuration fundamentally changes how the solder layer behaves during the joining process. The geometry promotes solder creep along the side surface and increases the wetted area on the tip surface, directly addressing both the limited coverage area and insufficient joining reliability issues simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the joining reliability of the solder layer, ensuring a stronger and more reliable connection between the substrates, reducing the risk of short circuits and maintaining the vacuum or negative pressure within the device.
Implementation Method 1
the solder layer is in contact with the tip surface. At least one side surface and the tip surface form an obtuse angle at the connection portion
Data Source
AI summary
Electronic device member comprises a first substrate, at least one protruding portion that protrudes from the first substrate, and a solder layer, wherein the at least one protruding portion includes at least one side surface, a tip surface, and a connection portion between the at least one side surface and the tip surface, and wherein the solder layer is in contact with the tip surface. At the connection portion, the at least one side surface and the tip surface form obtuse angle.