Protruding Lid Design for Fiber Optic Node Space Expansion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The limited physical space within existing fiber optic nodes poses a challenge for accommodating additional electrical or electronics equipment required for new fiber optic network architectures and topologies, such as remote physical layer (RPHY) and remote converged cable access platform (R-CCAP), without the need for replacing existing nodes, which would be costly and time-consuming.
Innovation Solution
A new fiber optic node lid design that retrofits existing nodes, expanding the interior space to accommodate new equipment while providing a larger heat sink surface area for improved heat dissipation, by protruding outward to increase the lid's surface area and volume, allowing for the installation of additional electronics and circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If existing fiber optic nodes are used without modification, then node replacement costs are avoided, but there is insufficient physical space to accommodate additional electrical or electronics equipment for new network architectures
Solution Approach 1:
The patent extends the lid outward in the vertical dimension beyond the base perimeter, creating additional interior volume without expanding the horizontal footprint. This dimensional extension allows the node to accommodate additional electronics for new architectures like RPHY and R-CCAP while maintaining compatibility with existing mounting structures and avoiding the need to replace entire nodes.
2Adaptability or versatility
If additional electrical or electronics equipment is installed inside the fiber optic node, then new network architectures can be supported, but heat dissipation becomes more challenging due to increased thermal load
Solution Approach 1:
The extended lid creates additional vertical space that can be utilized for heat dissipation structures. The increased volume allows for larger heat sinks, improved airflow channels, and thermal management components to be integrated without increasing the horizontal footprint, effectively managing the thermal load from additional electronics.
3Volume of moving object
If a larger fiber optic node is created to accommodate additional equipment, then more space is available for new electronics, but existing installed nodes would need to be replaced which is costly and time-consuming
Solution Approach 1:
The patent divides the node into separable components - specifically making the lid a removable and replaceable component. This segmentation allows the lid to be upgraded independently from the base, enabling operators to extend existing nodes by replacing only the lid rather than replacing entire nodes, significantly reducing deployment cost and time.
Solution Approach 2:
The node design transitions from a static, fixed-size enclosure to a dynamic, extensible structure. The lid can be upgraded or replaced to adapt to future space requirements, allowing the node to evolve its capacity over time without replacing the entire system, thus reducing long-term deployment costs.
4Volume of moving object
If the lid is extended outward to increase interior space, then additional electronics can be accommodated, but the heat sink surface area needs to be increased to manage thermal load
Solution Approach 1:
The lid extension in the vertical dimension provides both increased interior volume for electronics and increased external surface area for heat dissipation. The protruding portions of the lid can incorporate heat sinks, fins, or other thermal management features that leverage the additional surface area created by the dimensional extension, simultaneously addressing both space and thermal management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the integration of new electronics and circuit boards within existing fiber optic nodes, enhancing heat dissipation and accommodating evolving network architectures without the need for node replacement, thus optimizing space utilization and reducing replacement costs.
Implementation Method 1
protruding outwards to provide a larger surface area for a larger heat sink surface area to improve dissipation of excessive or unwanted heat from the newly installed electrical or electronics equipment
Data Source
AI summary
A fiber optic node includes an electronics equipment enclosure. The electronics equipment enclosure includes a lid and a base defining an overall interior space of the electronics equipment enclosure. The lid includes a lid top and a lid mating surface to contact and overlap a base mating surface of the base to close the electronics equipment enclosure. The lid further includes at least one lid side wall extending away from the lid top. The at least one lid side wall includes at least one protruding lid side wall extending outwards to project beyond the lid mating surface. The base includes a base bottom and at least one base side wall extending away from the base bottom. The base further includes a base mating surface to contact and overlap the lid mating surface of the lid to close the electronics equipment enclosure.