Protruding Markings on Circuit Module Burying Layer for Shielding
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Solution Overview
Problem
Electronic circuit modules with conductive films face reduced shielding capability due to markings penetrating thinner portions of the film or difficulty in forming conductive films within recessed markings, especially when using laser-based methods.
Innovation Solution
The implementation of markings with a protruding shape, formed using ink jet devices or discharging devices, which are conductive and exposed at the surface, allowing the conductive film to cover the outer surface of the burying layer while maintaining continuity and reducing profile height, using methods like sputtering, metal plating, or vapor deposition for the conductive film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If markings are made on the burying layer surface using laser, then product information can be marked, but the laser may penetrate through thinner portions of the conductive film and impair shielding capability
Solution Approach 1:
The marking is formed on the burying layer surface before the conductive film is deposited. By performing the marking action in advance, the protruding marking structure is created first, allowing the conductive film to be deposited over it in a subsequent step, ensuring the marking remains visible while the film provides continuous shielding.
Solution Approach 2:
Instead of forming the marking after depositing the conductive film (which would compromise shielding), the invention inverts the sequence by forming the marking first on the burying layer, then depositing the conductive film over the marking. This reversal ensures both marking visibility and shielding integrity.
2Loss of information
If the conductive film is formed after creating recess portions on the burying layer, then markings can be made, but it is difficult to form the conductive film inside the recess portions, particularly on wall surfaces, impairing shielding capability
Solution Approach 1:
The marking structure is formed on the burying layer surface before the conductive film deposition. This preliminary action creates a protruding feature that will be covered by the subsequently deposited film, ensuring the film can be continuously formed over the marking without leaving exposed recesses.
Solution Approach 2:
The conventional approach of forming recesses then depositing film is inverted. Instead, protruding markings are formed first, and the conductive film is deposited over them. This ensures the film covers both the marking and the surrounding area continuously, eliminating shielding gaps.
3Reliability
If a thick conductive film is formed to ensure continuous coverage over markings, then shielding capability is maintained, but the module profile height increases
Solution Approach 1:
By forming the marking structure on the burying layer before depositing the conductive film, the invention allows a thin film to be deposited over the marking. The marking protrudes through the thin film, providing visibility without requiring a thick film for coverage, thus maintaining low profile height while ensuring shielding continuity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures superior shielding capability and reduced profile height by maintaining the conductive film's continuity and recognizing markings clearly, even when covered, while avoiding the limitations of laser-formed recessed markings.
Implementation Method 1
the conductive film 7 is formed by at least one method selected from a group consisting of sputtering, metal plating, vapor deposition, and CVD
Implementation Method 2
the conductive film 7 is formed by at least one method selected from a group consisting of sputtering, metal plating, vapor deposition, and CVD
Implementation Method 3
markings of product information are made, for example, using a laser
Data Source
AI summary
An electronic circuit module includes a circuit board, electronic components, a burying layer, and a conductive film. The circuit board includes a first principal surface on which first electrodes are provided, a second principal surface on which second electrodes including grounding electrodes are provided, and a side surface connecting the first principal surface and the second principal surface. The electronic components are connected to the first electrodes. The burying layer is provided on the first principal surface of the circuit board with the electronic components buried therein. The conductive film is connected to the grounding electrodes. The outer surface of the burying layer includes markings with protruding shapes with respect to the outer surface of the burying layer. The conductive film covers the outer surface of the burying layer.