Protruding Structures for Semiconductor Substrate Alignment

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Solution Overview

Problem

Existing semiconductor package structures face challenges with warpage and misalignment issues due to coefficient of thermal expansion mismatches and non-planarity of electrical connectors, which affect bonding reliability and packaging efficiency.

Innovation Solution

The formation of protruding structures on both substrates provides mechanical and structural support, aligns electrical connectors accurately, and controls their height through a pressing process, ensuring planarity and improved bonding reliability by using these structures as alignment marks and support features during the bonding of substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If traditional package structures are used without protruding support structures, then the manufacturing process is simpler, but warpage occurs due to coefficient of thermal expansion mismatches

Engineering Contradiction:

Improvesubstrate planarityVSAvoidpackage structure complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The substrate support function is segmented by adding separate protruding structures at specific locations rather than requiring the entire substrate to be rigid. These discrete protruding structures provide localized support to counteract warpage without increasing overall structural complexity significantly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The solution moves from a two-dimensional planar substrate to a three-dimensional structure with protruding elements extending upward from the substrate surface. This dimensional change provides mechanical support and stability while maintaining manufacturing feasibility.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If electrical connectors are formed without height control, then the manufacturing process is simpler, but misalignment occurs during substrate bonding

Engineering Contradiction:

Improveelectrical connector alignmentVSAvoidbonding process complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The protruding structures are formed on the substrates before the bonding process. These pre-formed structures serve as alignment marks and height references, enabling precise electrical connector alignment during bonding without requiring complex real-time adjustment mechanisms.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The solution replaces complex mechanical alignment systems with a simpler approach using protruding structures as passive alignment references. The protruding structures provide geometric constraints that guide the bonding process, eliminating the need for sophisticated alignment machinery.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If substrates are bonded without protruding alignment structures, then the bonding process is faster, but bonding reliability decreases due to misalignment

Engineering Contradiction:

Improvebonding reliabilityVSAvoidpackaging efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The protruding structures on the substrates serve as self-aligning features that automatically guide the bonding process. The geometric shapes of these protruding structures provide inherent alignment cues, enabling the substrates to self-align during bonding without requiring external alignment equipment or complex control systems.

Inventive Principle:

Principle #25Self-service

4Manufacturing precision

If electrical connectors are non-planar, then the manufacturing process is simpler, but bonding accuracy deteriorates

Engineering Contradiction:

Improveconnector planarityVSAvoidheight control process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The protruding structures provide localized height control and planarization at the critical bonding interfaces where electrical connectors are located. Rather than requiring the entire substrate surface to be perfectly planar, the solution provides precision only where needed, reducing overall manufacturing complexity while maintaining bonding accuracy.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS10886147B1Package structure and method for forming the same

Publication Date: 2021.01.05 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method for forming the package structure is provided. The method includes forming a die structure over a first surface of a first substrate, and forming a plurality of electrical connectors below a second surface of the first substrate. The method also includes forming a first protruding structure below the second surface of the first substrate, and the electrical connectors are surrounded by the first protruding structure. The method further includes forming a second protruding structure over a second substrate, and bonding the first substrate to the second substrate. The electrical connectors are surrounded by the second protruding structure, and the first protruding structure does not overlap with the second protruding structure.