Protruding Via Interconnection for Dense Component Carrier Assembly
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Solution Overview
Problem
Interconnecting two or more component carriers, particularly in the Z-direction, is challenging due to limitations in structural feature sizes and the need for robust, reliable, and efficient connections in miniaturized electronic components.
Innovation Solution
A component carrier assembly is designed with a via that protrudes from a first component carrier and penetrates into an electrically conductive adhesive material embedded in a second component carrier, serving as an anchor structure for stable interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional sintering paste interconnection is used between two circuit boards, then the connection is established, but the structural feature sizes are strongly limited and miniaturization is constrained
Solution Approach 1:
The interconnection system is segmented into distinct functional elements: a protruding via structure from the first circuit board and a separate sintering paste layer on the second circuit board. This segmentation allows each element to be optimized independently, enabling smaller feature sizes in the via while maintaining reliable electrical connection through the dedicated sintering interface.
Solution Approach 2:
The via structure is prepared in advance with a protruding portion that extends beyond the first circuit board surface before the sintering paste is applied. This preliminary action allows the via to be precisely formed and positioned, enabling miniaturization while ensuring the protruding part can reliably penetrate and connect with the sintering paste layer in subsequent assembly.
2Reliability
If the via protrudes beyond the component carrier surface to enable reliable interconnection, then interconnection reliability is improved, but the device complexity increases
Solution Approach 1:
The protruding via structure serves multiple functions simultaneously: it provides mechanical support for the connection, establishes electrical continuity between layers, and creates a defined interface for sintering paste application. This multi-functionality reduces the need for additional separate components or complex assembly steps, thereby improving reliability without proportionally increasing device complexity.
Solution Approach 2:
The via structure is designed to self-align and self-position during assembly. The protruding via automatically finds its connection point on the sintering paste layer, eliminating the need for complex alignment mechanisms or precision positioning systems. This self-service capability simplifies the overall device structure while maintaining high interconnection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for efficient, reliable, and robust interconnections, enabling smaller feature sizes, reduced adhesive material use, increased package density, and improved reliability performance.
Implementation Method 1
a via in the first electrically insulating layer structure, wherein the via is filled with electrically conductive material
Implementation Method 2
an electrically conductive adhesive material that is embedded in the second electrically insulating layer structure
Data Source
AI summary
A component carrier assembly includes a first component carrier having a first electrically insulating layer structure and a via in the first electrically insulating layer structure, where the via is at least partially filled with electrically conductive material and where an upper part of the via extends beyond an outer main surface of the first component carrier; and a second component carrier having a second electrically insulating layer structure, and an electrically conductive adhesive material that is at least partially embedded in the second electrically insulating layer structure. The first component carrier and the second component carrier are interconnected and the upper part of the via at least partially penetrates into the electrically conductive adhesive material.