Protrusion Buffer Packaging for Shock Absorption

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Solution Overview

Problem

Existing packaging technologies fail to adequately protect products during transportation due to insufficient shock absorption and flexibility, leading to potential damage.

Innovation Solution

A buffer packing material with a substrate board featuring protrusions, such as half-sphere or cone-shaped projections, integrated into a package box design that allows for easy folding and secure closure, providing enhanced protection through internal and external projections that support and buffer accommodated objects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If traditional rigid packaging materials are used, then structural strength is improved, but shock absorption capability deteriorates

Engineering Contradiction:
Improvestructural strengthVSAvoidshock absorption capability
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The substrate board is designed with an array of projections (convex portions) that create a porous-like structure. These projections deform under impact forces, absorbing shock energy while maintaining the overall structural integrity of the packaging. This resolves the contradiction by providing both strength and shock absorption capability.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The packaging structure transitions from a flat rigid board to a three-dimensional structure with projections having specific geometric parameters (height, diameter, spacing). These parameter changes enable the material to exhibit both structural strength and shock absorption properties through controlled deformation of the projections.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If complex packaging structures are used, then protection capability is improved, but ease of manufacture deteriorates

Engineering Contradiction:
Improveprotection capabilityVSAvoidease of manufacture
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The substrate board is segmented into multiple projections arranged in an array pattern. Each projection acts as an independent shock-absorbing element, allowing the complex protection function to be achieved through simple, repetitive geometric features that are easy to manufacture using standard molding or cutting techniques.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The projections are designed with curved surfaces (spheroidal or conical shapes) rather than sharp edges. This curvature simplifies the molding process while providing effective shock absorption through gradual deformation. The curved geometry naturally distributes stress and is easier to manufacture than complex angular structures.

Inventive Principle:
Principle #14Spheroidality (Curvature)

3Adaptability or versatility

If packaging materials with high flexibility are used, then adaptability is improved, but structural strength deteriorates

Engineering Contradiction:
ImproveflexibilityVSAvoidstructural strength
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The packaging structure incorporates dynamic elements through the projections that can deform elastically under load. The projections bend and compress to absorb impacts, then return to their original shape, providing both flexibility for adaptation to different packaging needs and sufficient structural strength when required.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The buffer packing material effectively absorbs shocks and protects products during transit by distributing force across the projections, reducing the risk of damage and facilitating easy storage and assembly of the package box.

Implementation Method 1

The buffer packing material effectively absorbs shocks and protects products during transit by distributing force across the projections

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS10252846B2Package box
Publication Date: 2019.04.09 HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO LTD
  • US10252846B2 patent drawing
  • US10252846B2 patent drawing
  • US10252846B2 patent drawing

AI summary

A package box includes a substrate board and a plurality of projections. The projections are formed on the substrate board. The substrate board includes a first surface and a second surface. The first surface is opposite to the second surface. Each of the projections is formed when the first surface of the substrate board protrudes toward the second surface of the substrate board.