Thermally Conductive Protrusion for Case Temperature Measurement
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Solution Overview
Problem
Accurately measuring the case temperature of fiber optic transceivers is challenging due to the complexity and cost of affixing temperature sensors directly to the case during assembly, which is essential for optimal operation, especially in Dense Wave Division Multiplexing (DWDM) systems and Avalanche Photodiodes (APD) applications.
Innovation Solution
A case temperature measurement system that thermally couples a temperature sensor to a thermally conductive protrusion extending from the case wall, allowing for direct measurement of the case temperature without the need for direct affixation, using a thermally conductive protrusion and thermal pad for efficient heat transfer, and optionally estimating the case surface temperature from internal component temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is affixed directly to the case wall during assembly, then accurate case temperature measurement is achieved, but the assembly process becomes complex, difficult, and costly requiring additional resources
Solution Approach 1:
A thermally conductive protrusion is introduced as an intermediary element between the case wall and the temperature sensor. The protrusion extends from the case wall into the case interior and is thermally coupled to the temperature sensor, which is mounted on the circuit board. This intermediary structure enables thermal coupling without requiring direct affixation of the sensor to the case wall, thereby maintaining measurement accuracy while simplifying the assembly process.
Solution Approach 2:
The invention replaces the mechanical affixation system (direct mounting of temperature sensor to case wall) with a thermal conduction system. Instead of mechanically attaching the sensor directly to the case, the solution uses the thermally conductive protrusion to transfer heat from the case wall to the sensor mounted on the circuit board, substituting mechanical complexity with thermal conduction principles.
2Measurement precision
If a temperature sensor is affixed directly to the case wall, then accurate case temperature measurement is achieved, but additional assembly resources such as assembly time and skilled labor are required
Solution Approach 1:
The thermally conductive protrusion serves as a pre-integrated intermediary that eliminates the need for additional assembly steps. The protrusion is formed as part of the case structure, and the temperature sensor is mounted on the circuit board during normal assembly, avoiding the need for separate sensor affixation operations and reducing assembly time and skilled labor requirements.
3Ease of manufacture
If internal temperature is measured instead of case temperature, then measurement is simpler, but the temperature reading does not accurately reflect the case temperature needed for APD bias adjustment and DWDM system operation
Solution Approach 1:
The thermally conductive protrusion acts as a thermal bridge that connects the case wall temperature to the temperature sensor on the circuit board. This intermediary structure allows the sensor to measure case temperature accurately without being directly exposed to the case wall, maintaining measurement simplicity while achieving accurate case temperature readings for APD bias adjustment and DWDM system operation.
Solution Approach 2:
The invention substitutes direct thermal contact measurement with indirect thermal conduction measurement. Instead of placing the sensor directly in contact with the case wall or measuring internal air temperature, the solution uses the thermally conductive protrusion to conduct heat from the case wall to the sensor, providing accurate case temperature measurement through thermal conduction principles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and cost-effective measurement of case temperature, improving APD bias adjustment and DWDM system performance by eliminating the need for complex sensor affixation, while allowing precise temperature data storage and access for host systems.
Implementation Method 1
at least one thermally conductive protrusion extending from the wall and thermally coupled to the temperature sensor
Data Source
AI summary
A communications device with integrated case temperature measurement includes a case having at least one thermally conductive wall and a circuit board at least partially disposed within the case. At least one electronic component is mounted on the circuit board and a temperature sensor is mounted on the circuit board. At least one thermally conductive protrusion extends from the wall and is thermally coupled to the temperature sensor.