Protrusion Connector Structure for Stable PCB Contact and ESD Dissipation

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Solution Overview

Problem

Conductive adhesives face instability in electrical connection performance due to changes in volume or shape under stress and climate conditions, leading to poor conduction with circuit boards and accumulation of static charges, which interferes with signal transmission.

Innovation Solution

A connector design featuring an insulator with conductive layers and protrusion portions on its surface, connected by a conductive medium, allowing for repeated assembly and disassembly, improved conductivity, and effective static charge dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If too many particles and less glue are arranged in the conductive adhesive to ensure electrical connection, then the electrical conductivity is improved, but the adhesion performance deteriorates and the conductive adhesive is easy to fall off

Engineering Contradiction:
Improveelectrical connection performanceVSAvoidadhesion performance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent changes the physical state of the conductive adhesive from a traditional paste with particles and glue to a gel状 conductive adhesive with specific viscosity (100-10000 cP) and gel content (20-80%). This parameter change allows the adhesive to maintain both good electrical conductivity and strong adhesion performance simultaneously, resolving the contradiction between conductivity and adhesion.

Inventive Principle:
Principle #35Parameter changes

2Strength

If few particles and more glue are arranged in the conductive adhesive to ensure the adhesion performance, then the adhesion performance is improved, but the resistance is relatively large and the electrical connection performance is poor

Engineering Contradiction:
Improveadhesion performanceVSAvoidelectrical connection performance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent modifies the conductive adhesive to have specific gel content (20-80%) and viscosity (100-10000 cP), transforming it from a particle-glue mixture to a gel-based material. This parameter change enables the adhesive to achieve both strong adhesion and low resistance, simultaneously improving both adhesion performance and electrical connection performance.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If the volume or shape of the conductive adhesive matrix changes under stress and climate conditions, then the stacking state of conductive particles changes, but the electrical connection performance becomes unstable

Engineering Contradiction:
Improveresponse to stress and climateVSAvoidelectrical connection performance stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent uses a gel-based conductive adhesive that combines the properties of gel materials with conductive fillers. The gel matrix provides structural stability and resistance to volume/shape changes under stress and climate conditions, while maintaining stable electrical connection performance. This composite material approach resolves the contradiction between adaptability to environmental conditions and stability of electrical performance.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS11962112B2Connector and manufacturing method
Publication Date: 2024.04.16 GUANGZHOU FANGBANG ELECTRONICS
  • US11962112B2 patent drawing
  • US11962112B2 patent drawing
  • US11962112B2 patent drawing

AI summary

A connector and a manufacturing method of the connector are provided. The connector, comprising an insulator (10), a first conductive layer (11) disposed on one side surface of the insulator (10), and a second conductive layer (12) disposed on the other side surface of the insulator (10), the insulator (10) is further provided with a conductive medium (13) connecting the first conductive layer (11) and the second conductive layer (12), and a protrusion portion (14) is disposed on the surface of the first conductive layer (11) or/and the second conductive layer (12).