Protrusion Support Substrate for Warpage-Free Semiconductor Packaging
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Solution Overview
Problem
The increasing thinness and complexity of semiconductor packages lead to higher probabilities of defects due to warpage during manufacturing, necessitating a solution that reduces process defects and simplifies manufacturing processes.
Innovation Solution
A support substrate with a main body and intersecting protrusions of the same material, forming a unitary structure, which provides Van der Waals attraction for adhesion without the need for adhesives, allowing for simplified and defect-reduced fabrication of semiconductor packages and electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package substrates are made thinner to reduce horizontal size, then the compactness and integration of semiconductor packages are improved, but the probability of defects increases due to warpage during manufacturing processes
Solution Approach 1:
The support substrate is segmented into a main body and multiple protrusions that extend into the mold layer. This segmentation allows the support substrate to maintain structural integrity while providing distributed support points that prevent warpage of thin package substrates during manufacturing processes
Solution Approach 2:
The protrusions are pre-formed on the support substrate before the package substrate is mounted. This preliminary structure provides immediate mechanical support and prevents warpage during subsequent manufacturing steps, eliminating the need for additional warpage compensation measures
2Strength
If adhesives are used to bond the support substrate to the package substrate, then the adhesion strength is improved, but the process complexity and defect risk increase
Solution Approach 1:
The adhesive layer is completely removed from the bonding interface. Instead of using adhesives, the protrusions mechanically interlock with the mold layer, creating a solvent-free bonding interface that eliminates adhesive-related defects and simplifies the manufacturing process
Solution Approach 2:
The protrusions serve as a mechanical intermediary between the support substrate and the mold layer. These protrusions penetrate the mold layer and provide direct structural coupling, replacing the adhesive mediator with a mechanical coupling mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support substrate enables excellent bonding and adhesion, reducing the risk of defects and process costs by eliminating the need for adhesives, while maintaining structural integrity and facilitating the manufacturing of thin, complex semiconductor packages.
Implementation Method 1
provides Van der Waals attraction for adhesion without the need for adhesives
Data Source
AI summary
Disclosed are support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same. The support substrate comprises a main body, and a plurality of first protrusions finely protruding from an upper surface of the main body. The main body and the first protrusions include the same material and are formed as a unitary structure. The first protrusions are spaced apart from each other in first and second directions intersecting each other, when viewed in plan.