Proximity Detector with Stacked ICs and Interconnect Layers
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Solution Overview
Problem
The existing proximity detector devices in electronic devices are inefficient to manufacture and difficult to integrate into mobile devices due to their multi-step high precision assembly process and size constraints, which leads to increased manufacturing time and reliability issues.
Innovation Solution
A proximity detector device is designed with a first and second interconnect layer comprising dielectric layers and electrically conductive traces, with an image sensor IC and light source IC laterally spaced, coupled to the traces, and a lens assembly integrated using robust wafer level processing techniques, allowing for reduced size and efficient manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a multi-step high precision assembly process using P&P device is used, then the proximity detector can be assembled with image sensor IC and light source device, but the manufacturing efficiency is low and manufacturing time is increased
Solution Approach 1:
The patent combines the image sensor IC and light source device into a single integrated circuit board assembly, eliminating the need for separate pick-and-place operations for each component. The integrated design allows both components to be mounted simultaneously using a single adhesive layer, significantly reducing assembly steps and manufacturing time while maintaining precise alignment.
2Ease of manufacture
If a multi-step high precision assembly process is used, then the proximity detector can be assembled with cap, lens, and wire bonds, but the device size increases and integration into mobile devices becomes difficult
Solution Approach 1:
The patent implements a nested structure where the image sensor IC and light source device are mounted on the same circuit board, the cap covers both components, and the lens is positioned over the cap opening. This nested arrangement minimizes the overall device footprint by stacking components vertically rather than spreading them out horizontally, making the device suitable for mobile device integration.
3Ease of manufacture
If separate mounting of image sensor IC and light source device is performed, then each component can be positioned, but the alignment precision and co-planarity are difficult to achieve
Solution Approach 1:
The patent incorporates alignment marks and positioning features directly into the circuit board design before component mounting. The adhesive layer is applied with pre-defined thickness control, and the cap includes positioning protrusions that align with corresponding features on the circuit board. These preliminary alignment features ensure precise co-planarity of the image sensor IC and light source device without requiring complex post-mounting adjustment procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient manufacturing and integration into mobile devices, providing a mechanically robust and thinner packaging with improved co-planarity of ICs, reducing computational load and manufacturing time while enhancing reliability.
Implementation Method 1
the proximity detector comprises a light source directing radiation to a potential nearby object, and an image sensor receiving the radiation reflected off of the nearby object
Data Source
AI summary
A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.