Proximity Head Bubble Removal via Inverted V-Channel
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Solution Overview
Problem
Air bubbles trapped in proximity heads of linear wet-deposition systems can accumulate on semiconductor wafers, preventing uniform fluid deposition due to the hydrophobic and oleophobic nature of the wafer surfaces.
Innovation Solution
A top proximity head with a delivery bore, plenum, and inverted V-shaped openings that facilitate the upward flow of air bubbles into the delivery bore, connected by a passage to a return bore, allowing air bubbles to escape while minimizing fluid flow between the bores, and using alternating cycles of fluid delivery and idle time to eliminate bubbles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a proximity head is used to deposit fluid onto a semiconductor wafer, then fluid deposition is achieved, but air bubbles become trapped in the proximity head and accumulate on the wafer surface
Solution Approach 1:
The patent extracts and removes air bubbles from the proximity head system by providing a dedicated bubble removal passage that allows bubbles to escape from the plenum chamber back to the fluid source, preventing bubble accumulation on the wafer surface while maintaining continuous fluid deposition
Solution Approach 2:
The patent introduces a bubble removal passage as an intermediary pathway between the plenum chamber and fluid source, enabling selective removal of air bubbles while allowing fluid to continue flowing through the proximity head for deposition onto the wafer
2Productivity
If the proximity head operates continuously to maintain fluid deposition, then productivity is improved, but air bubbles accumulate in the proximity head over time
Solution Approach 1:
The patent enables continuous operation of the proximity head by implementing a bubble removal passage that allows air bubbles to be continuously extracted from the plenum chamber during fluid deposition, maintaining reliable bubble-free operation over extended periods without interrupting productivity
Solution Approach 2:
The patent continuously extracts air bubbles from the proximity head through the dedicated bubble removal passage during operation, preventing bubble accumulation and maintaining reliability over time while preserving continuous fluid deposition capability
3Manufacturing precision
If the proximity head is designed with a plenum chamber to distribute fluid, then fluid distribution is improved, but air bubbles become trapped in the plenum
Solution Approach 1:
The patent addresses the bubble trapping issue in the plenum chamber by providing a dedicated bubble removal passage that extracts bubbles from the plenum while preserving the chamber's fluid distribution function, effectively separating the bubble removal function from the fluid distribution function
4Reliability
If a passage is added to allow air bubbles to escape from the delivery bore, then bubble removal is improved, but fluid may flow directly between bores bypassing the plenum
Solution Approach 1:
The patent applies local quality by making the bubble removal passage selectively permeable or restricted in a specific location, allowing air bubbles to pass through while preventing significant fluid flow, thus enabling bubble escape while minimizing fluid loss through bypass
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures air-free fluid deposition on semiconductor wafers by effectively removing air bubbles from the proximity head, maintaining a bubble-free state for extended periods, even during idle times, thereby ensuring uniform fluid distribution and deposition.
Implementation Method 1
each of the input channels has an inverted V-shaped opening which urges the upward flow of any air bubbles in the plenum
Implementation Method 2
A passage connects the delivery bore with the return bore allowing air bubbles to escape from the delivery bore into the return bore. The connecting passage allows a negligible amount of fluid to flow directly between the two bores rather than through the plenum.
Implementation Method 3
The fluid suctioned and output from the proximity head by a suction bore would consist of the negligible amount of fluid flowing directly between the delivery bore to the suction bore through the connecting passage.
Data Source
AI summary
In an example embodiment, a top proximity head for depositing fluids on a semiconductor wafer includes a delivery bore which receives fluid. The top proximity head includes a plenum that is connected to the delivery bore by numerous input channels into which fluid flows from the delivery bore. Each input channel has an inverted V-shaped opening which urges the upward flow of any air bubbles. From the plenum, the fluid flows through output channels out of the top proximity head to form a meniscus. The fluid is suctioned from the meniscus back into the top proximity head through return channels that lead to a return bore. A passage connects the delivery bore with the return bore, allowing air bubbles to escape from the delivery bore into the return bore. The passage allows a negligible amount of fluid to flow directly between the two bores rather than through the plenum.