Proximity Sensor Connection Layout for Borderless Display Assembly
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Solution Overview
Problem
Conventional electronic device configurations result in increased space occupation due to stacked assemblies of components, particularly with proximity sensors, which limits device compactness and efficiency in manufacturing.
Innovation Solution
Electrical connection of proximity sensors to components in front of them along the Z-axis direction, bypassing the circuit board, allowing for reduced component stacking and facilitating 'borderless' display configurations, while also simplifying manufacturing by reducing assembly gaps and component complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the proximity sensor is connected to the circuit board through a stacked assembly configuration, then the electrical connection is established, but the space occupied in the Z direction increases
Solution Approach 1:
The patent changes the connection direction from the traditional Z-axis (stacked assembly) to the X-Y plane by routing conductive traces through the circuit board. The proximity sensor is positioned such that its connection point on the front surface connects to the circuit board through lateral routing rather than vertical stacking, effectively moving the connection path to a different dimension and reducing Z-direction space occupation.
2Reliability
If the proximity sensor is connected through the circuit board, then electrical connection is achieved, but the circuit board surface space is consumed
Solution Approach 1:
The patent extracts the electrical connection path from the traditional circuit board trace routing by using a conductive adhesive or conductive epoxy to create the connection. This removes the need for dedicated circuit board traces and pads for the proximity sensor, freeing up valuable circuit board surface space for other components or functions.
3Ease of manufacture
If conventional stacked assembly is used for component arrangement, then manufacturing is simplified, but assembly gaps and tolerance loops increase
Solution Approach 1:
The patent merges the proximity sensor housing with the circuit board structure by integrating the sensor directly into the circuit board assembly. The conductive adhesive serves dual purposes as both mechanical adhesive and electrical conductor, combining multiple functions into a single integration step that reduces assembly gaps and eliminates intermediate tolerance loops between separate components.
Data Source
AI summary
An electronic device includes: a display assembly including an electronic display configured to generate an optical image viewable from in front of the electronic device; a proximity sensor coupled to at least a portion of the display assembly, the proximity sensor including a sensing element configured to be responsive to presence of an object in front of the electronic device, the sensing element supported by a support structure having an upper surface facing a frontal direction of the electronic device; and a conductor that electrically connects the sensing element of the proximity sensor and the portion of the display assembly, the conductor including a conductive path extending along the support structure to the upper surface of the support structure.