Proximity Sensor Integrated Substrate Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high manufacturing cost and reduced productivity of proximity sensors due to the use of a cap in existing designs, which increases production time and costs.
Innovation Solution
A proximity sensor design that integrates a light-emitting device directly on a sensor chip, sealed with a transparent molding material and isolated from the sensor region using a non-transparent molding material, eliminating the need for a cap and allowing for reduced size and improved manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cap is used to cover the light-emitting device and sensor chip, then the sensor structure is protected and assembled, but the manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent merges the cap and substrate functions into a single integrated substrate structure. The substrate directly covers and protects the light-emitting device and sensor chip without requiring a separate cap component, thereby eliminating assembly steps and improving productivity while maintaining structural protection.
Solution Approach 2:
The patent extracts and eliminates the cap component from the traditional sensor structure. By removing the cap and integrating its protective function into the substrate, the design reduces the number of parts and assembly operations, directly addressing the productivity issue while maintaining necessary protection through the substrate structure.
2Reliability
If a cap is used to cover the light-emitting device and sensor chip, then the sensor structure is protected, but the manufacturing cost increases
Solution Approach 1:
The patent combines the protective function previously requiring a separate cap into the substrate itself. This integration eliminates the need for additional cap materials and assembly processes, reducing manufacturing costs while maintaining the protective function through the substrate's structural design.
Solution Approach 2:
The patent removes the cap component from the bill of materials and assembly process. By extracting this unnecessary component and integrating its function into the substrate, the design directly reduces material costs and manufacturing complexity while preserving structural protection.
3Stability of the object's composition
If a substrate is used to support the sensor chip, then the sensor chip is held in position, but the overall size of the proximity sensor increases
Solution Approach 1:
The patent merges the substrate and cap functions into a single integrated structure that serves both as a support for the sensor chip and as a protective cover. This integration eliminates the need for separate components, reducing the overall volume of the proximity sensor while maintaining stable positioning of the sensor chip through the integrated substrate structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing costs and enhances productivity by eliminating the cap and substrate, while maintaining the functionality of the proximity sensor.
Implementation Method 1
a transparent molding material at least covering a light-emitting surface of the light-emitting device
Implementation Method 2
a non-transparent molding material isolating the transparent molding material from the sensor region
Data Source
AI summary
The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a sensor chip, a light-emitting device, a transparent molding material and a non-transparent molding material, wherein the sensor chip comprises a sensor region; the light-emitting device is located on the sensor chip and is electrically coupled to the sensor chip; the transparent molding material at least covers a light-emitting surface of the light-emitting device; and the non-transparent molding material isolates the transparent molding material from the sensor region.