Compact Proximity Sensor with Integrated Light Barrier
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Solution Overview
Problem
Conventional proximity sensors have a large footprint, making it challenging to mount more components on smaller printed circuit boards in consumer electronics, which are trending towards smaller sizes with increased capabilities.
Innovation Solution
The design includes a proximity sensor with a cap having a light barrier between the light emitting device and the sensor area, positioned over the semiconductor die, which reduces the overall footprint by integrating the light emitting diode and light blocking layer with the sensor chip, and uses a substrate with contact pads for electrical connections, allowing for a smaller form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If conventional proximity sensor design is used, then optical performance is maintained, but footprint area is large
Solution Approach 1:
The patent merges the light emitting device, light barrier, and sensor die into a single integrated package structure. The light emitting device and light barrier are positioned on the same substrate as the sensor die, with electrical connections made through the substrate, eliminating the need for separate mounting of these components and reducing overall footprint area.
Solution Approach 2:
The patent utilizes three-dimensional positioning within the package, placing the light emitting device and light barrier at different heights and positions relative to the sensor die. The light barrier is positioned between the light emitting device and sensor die in the vertical dimension, while electrical connections are routed through the substrate plane, effectively using multiple dimensions to reduce the two-dimensional footprint.
2Area of moving object
If component integration is increased, then footprint is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the proximity sensor into distinct functional modules: sensor die, light emitting device, light barrier, and substrate, each with specific functions. This segmentation allows for standardized manufacturing of individual components that can be assembled through controlled processes, reducing overall manufacturing complexity while achieving integration.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for all components, establishes electrical connections between components through conductive traces, and positions components in precise three-dimensional relationships. This multi-functionality reduces the number of separate manufacturing steps needed compared to using separate structures for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a significantly smaller footprint for the proximity sensor, enabling more components to be mounted on smaller printed circuit boards while maintaining effective optical performance and mechanical support, thus addressing the need for compactness in modern electronics.
Implementation Method 1
Light emitted by the light emitting device 120 may exit the proximity sensor 100 via the first aperture 104
Implementation Method 2
be reflected by an object in the vicinity of the proximity sensor 100
Implementation Method 3
impact the sensor area 124. The proximity sensor 100 outputs a signal indicative of the intensity of light that is incident on the sensor area 124
Implementation Method 4
a light barrier disposed between the light emitting device and the sensor area of the semiconductor die
Data Source
AI summary
A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.