Proximity Sensor Capless Packaging via Molding Isolation
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Solution Overview
Problem
The high manufacturing costs and time-consuming process of producing proximity sensors due to the use of a separate cap in existing designs, which increases productivity costs.
Innovation Solution
A proximity sensor design that eliminates the need for a cap by using a non-transparent isolation structure and molding material to package the sensor chip and light-emitting device, with specific openings for light-transmitting components and a non-transparent molding material that does not cover the sensor region or light-emitting device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate cap is used to package the proximity sensor, then the sensor is protected and functional, but the manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent merges the cap structure with the molding material by integrating the light-emitting device opening and sensor region opening directly into the molding material body. This eliminates the separate cap component and its assembly process, reducing manufacturing steps while maintaining the protective enclosure function.
Solution Approach 2:
The molding material serves multiple functions simultaneously: it provides structural support, protects the sensor chip and light-emitting device, creates precise openings for light transmission, and eliminates the need for a separate cap. This multi-functional integration resolves the contradiction between protection and manufacturing efficiency.
2Reliability
If a separate cap is used to package the proximity sensor, then the sensor is protected, but the manufacturing cost increases
Solution Approach 1:
The cap structure is merged with the molding material, eliminating the need for a separate cap component. This reduces the number of parts and assembly operations, directly lowering manufacturing cost while maintaining the protective function through the integrated molding structure.
Solution Approach 2:
The separate cap component is extracted from the assembly, and its protective function is transferred to the molding material itself. This eliminates the need for additional cap manufacturing and assembly processes, reducing overall manufacturing cost.
3Reliability
If a separate cap is mounted for each individual proximity sensor, then the sensor is protected, but the manufacturing process takes longer time
Solution Approach 1:
The openings for the light-emitting device and sensor region are pre-formed within the molding material during the molding process itself, before assembly. This preliminary action eliminates the need for subsequent cap mounting operations, reducing manufacturing cycle time while ensuring precise positioning.
Solution Approach 2:
The protective enclosure and the light-transmitting openings are combined into a single integrated molding operation. This merging of functions into one process step eliminates multiple sequential operations, significantly reducing the manufacturing cycle time.
Data Source
AI summary
The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.