Proximity Sensor Resin Body Optical Isolation
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Solution Overview
Problem
Conventional proximity sensors are complex in structure and large in size due to the need for light shielding resins and metal housings to achieve optical isolation, which complicates their design and increases costs.
Innovation Solution
A proximity sensor with a surface emission laser and a light receiving part integrated within a light transmissive resin body, eliminating the need for separate light shielding walls and allowing for a more compact design by using the resin to cover both components and control the emission angle of light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If light shielding resin and metal housing are used to achieve optical isolation, then crosstalk is reduced, but device complexity and size increase
Solution Approach 1:
The patent merges the light shielding function with the resin body that covers the light emitting element. The resin body itself is configured to provide optical isolation between the light emitting element and light receiving element, eliminating the need for separate light shielding resin and metal housing structures. This integration reduces device complexity while maintaining crosstalk reduction.
Solution Approach 2:
The resin body serves multiple functions simultaneously: it protects the light emitting element, provides optical isolation to reduce crosstalk, and structures the sensor housing. This multi-functionality eliminates the need for separate specialized components, reducing overall device complexity.
2Reliability
If light shielding resin and metal housing are used to achieve optical isolation, then crosstalk is reduced, but device size increases
Solution Approach 1:
The patent combines the light shielding function into the resin body structure, eliminating the need for additional separate shielding components. This integration significantly reduces the overall sensor size while maintaining effective optical isolation between the light emitting and receiving elements.
3Reliability
If separate light shielding structures are formed between light emitting element and light receiving element, then optical isolation is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent integrates the light shielding function into the resin body that already covers the light emitting element. This eliminates the need for separate manufacturing steps to create additional shielding structures, simplifying the manufacturing process and reducing costs while maintaining optical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the sensor's structure, reduces crosstalk, and makes the sensor more compact, while also lowering manufacturing costs and allowing for more precise control over light emission and reception.
Implementation Method 1
a light emitting element and a light receiving element... The object is irradiated with light from the light emitting element
Implementation Method 2
reflected light from the object is received in the light receiving element
Implementation Method 3
The resin body is made of a light transmissive resin through which the light emitted from the surface emission laser transmits
Data Source
AI summary
A proximity sensor includes: a support substrate having a main surface and a rear surface; a surface emission laser; a light receiving part; and a resin body, wherein the surface emission laser is disposed on the main surface so as to emit light in a direction away from the rear surface; wherein the resin body is made of a light transmissive resin, and is disposed on the main surface so as to cover the surface emission laser and the light receiving part, and a portion of the resin body between the surface emission laser and the light receiving part is formed of the same light transmissive resin as the other portions, and wherein the light receiving part is disposed at a position at which the light emitted from the surface emission laser is reflected at an object and reflected light from the object is incident onto the light receiving part.