Proxy Die Aggregates Memory Sensor Data
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Solution Overview
Problem
Current memory systems face challenges in accurately managing thermal conditions within DRAM packages due to the coarse granularity of temperature sensing, which is insufficient for multichip packages, leading to inefficiencies in memory power management and refresh rates.
Innovation Solution
Implementing a system that passes sensing information from memory modules to the host via a proxy, allowing for finer granularity of temperature sensing and other data without increasing the number of signal lines, thereby eliminating the need for multiple thermal sensors on each memory module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple thermal sensors are added to each memory module for finer temperature sensing granularity, then temperature measurement precision is improved, but device complexity and BOM cost increase
Solution Approach 1:
The patent introduces a proxy die as an intermediary component that aggregates temperature data from multiple memory dies. Instead of connecting each die directly to the host with its own sensor, the proxy die collects sensing information from multiple dies and presents a single aggregated temperature reading to the host, thereby achieving fine-grained monitoring without proportional increases in external connections or system complexity
Solution Approach 2:
The patent merges multiple temperature sensing functions into a single proxy die that represents multiple memory dies. By combining the sensing information from multiple dies and presenting it through a single interface to the host, the system achieves comprehensive temperature monitoring while reducing the number of external signal lines and simplifying the overall device architecture
2Measurement precision
If multiple thermal sensors are added to each memory module, then temperature measurement precision is improved, but the number of signal lines increases
Solution Approach 1:
The proxy die serves as an intermediary that consolidates multiple temperature sensing channels into a single communication interface. It collects data from multiple memory dies internally and presents a unified temperature reading to the host, thereby maintaining high measurement precision across multiple dies while using only one set of external signal lines
Solution Approach 2:
The proxy die performs multiple functions: it acts as a temperature sensor for multiple dies simultaneously, serves as a data aggregation point, and provides a single unified interface to the host. This multi-functionality allows the system to monitor temperatures across multiple dies without requiring separate dedicated signal lines for each sensor
3Measurement precision
If two TSODs are placed on a memory module for better thermal sensing, then temperature measurement precision is improved, but board space consumption increases
Solution Approach 1:
The patent merges the functions of multiple temperature sensors into a single proxy die located on the memory module. This single component represents and aggregates data from multiple memory dies, providing comprehensive thermal coverage without requiring multiple separate TSOD components that would consume additional board space
Data Source
AI summary
A system includes a memory die stack that provides sensing information via proxy. The memory die stack includes at least a first memory die with a sensor that generates sensing data for the first memory die and a second memory die with a sensor that generates sensing data for the second memory die. The proxy is a logic device that aggregates and sends the sensing data for both memory dies over a management communication bus.