Pressure Sensitive Adhesive Wire Network Attachment for Photovoltaic Cells
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Solution Overview
Problem
Photovoltaic modules face challenges in maintaining efficient electrical connections and mechanical stability due to parasitic series resistances and temperature fluctuations, which affect their performance and reliability.
Innovation Solution
The use of pressure-sensitive adhesives (PSAs) to secure wire networks to photovoltaic cells, providing mechanical support and maintaining electrical contact, with curing methods such as UV radiation or high temperatures to increase mechanical stability at operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire networks are attached to photovoltaic cells without adequate mechanical support, then electrical connections can be established, but wire floating occurs under temperature fluctuations reducing reliability
Solution Approach 1:
The adhesive undergoes parameter changes through curing processes (UV irradiation, heat treatment, or moisture exposure) that transform it from a soft, flowable state during application to a rigid, high-modulus state at operating temperature. This parameter transformation ensures the adhesive provides adequate mechanical support and prevents wire floating while maintaining electrical contact stability.
Solution Approach 2:
The adhesive is formulated as a composite material combining polymer matrices with reactive groups that enable cross-linking through various curing mechanisms. This composite structure provides both the initial softness needed for void-free distribution and the final hardness required for mechanical stability at elevated temperatures.
2Strength
If adhesive is applied to secure wire networks, then mechanical support is provided, but voids may form reducing electrical contact quality
Solution Approach 1:
The adhesive is applied in a preliminary soft state that allows it to flow and conform to the wire network and cell surface geometry before curing. This preliminary action ensures complete wetting and void-free distribution, after which the adhesive is cured to provide the necessary mechanical strength.
Solution Approach 2:
The adhesive exhibits dynamic properties, being soft and flowable during application to ensure proper distribution, then transforming to a rigid state after curing to provide mechanical support. This dynamic behavior allows the same material to fulfill both requirements at different stages.
3Stability of the object's composition
If high modulus adhesive is used to prevent wire floating, then mechanical stability improves, but application becomes difficult due to lack of flowability
Solution Approach 1:
The adhesive application process occurs in periodic stages: first in a soft, flowable state for easy application and void-free distribution, then after curing transformation to a rigid state for mechanical stability. This periodic transformation of physical state resolves the contradiction between applicability and performance.
Solution Approach 2:
The adhesive undergoes phase transitions from a soft, uncured state to a hard, cured state through exposure to UV light, heat, or moisture. This phase transition enables the adhesive to be easily applied in its soft state and then provide mechanical stability in its hard state, resolving the contradiction between ease of manufacture and wire network stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces wire floating and enhances module performance by providing robust mechanical and electrical stability, even under temperature fluctuations, thereby improving the reliability and efficiency of photovoltaic modules.
Implementation Method 1
The PSA may be then cured by, for example, exposing it to Ultra Violet (UV) radiation to increase its mechanical stability at high temperatures
Implementation Method 2
curing involves exposing the PSA to at least about 145° C. to increase cross-linking of the PSA
Data Source
AI summary
Provided are novel methods of fabricating photovoltaic modules using pressure sensitive adhesives (PSA) to secure wire networks of interconnect assemblies to one or both surfaces of photovoltaic cells. A PSA having suitable characteristics is provided near the interface between the wire network and the cell's surface. It may be provided together as part of the interconnect assembly or as a separate component. The interconnect assembly may also include a liner, which may remain as a part of the module or may be removed later. The PSA may be distributed in a void-free manner by applying some heat and/or pressure. The PSA may then be cured by, for example, exposing it to UV radiation to increase its mechanical stability at high temperatures, in particular at a, for example the maximum, operating temperature of the photovoltaic module. For example, the modulus of the PSA may be substantially increased during this curing operation.