Pseudo Catalyst Film Formation Control in Semiconductor Substrate Processing

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Solution Overview

Problem

In semiconductor device manufacturing, using a single species of organic-based source in film formation processing limits the ability to change film formation rate, temperature, and properties, making it difficult to achieve desired film characteristics.

Innovation Solution

Incorporating a pseudo catalyst, such as a halogen compound or boron compound, into the process chamber with the organic-based source to control film formation, allowing for adjustments in film formation rate, temperature, and properties without changing the source.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a single species of organic-based source is used in film formation processing, then the process is simple and cost-effective, but the ability to change film formation rate, temperature, and properties is limited

Engineering Contradiction:
Improveability to change film formation rate, temperature, and propertiesVSAvoidprocess complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

A pseudo-catalyst (halogen compound or boron compound) is introduced as an intermediary substance that mediates between the organic-based source and the substrate. This pseudo-catalyst enables control over film formation rate, temperature, and properties without requiring changes to the organic-based source itself, thus maintaining process simplicity while achieving versatility.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the chemical composition parameter by introducing a pseudo-catalyst (halogen compound or boron compound) into the system. This parameter change allows control over film formation characteristics (formation rate, temperature, properties) without changing the organic-based source, resolving the contradiction between simplicity and adaptability.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If multiple sources are used to control film properties, then film characteristics can be optimized, but the manufacturing process becomes more complex and costly

Engineering Contradiction:
Improvefilm property controlVSAvoidmanufacturing process simplicity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The pseudo-catalyst serves as an intermediary that enables precise control of film properties (composition, formation rate, temperature) without requiring multiple organic-based sources. This maintains ease of manufacture by keeping the source system simple while achieving the film property control that would otherwise require multiple sources.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The pseudo-catalyst (halogen compound or boron compound) is used in small amounts and can be easily replenished, serving as a cost-effective means to control film properties without the need for expensive multiple organic-based sources. This resolves the contradiction between manufacturing precision and ease of manufacture.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Productivity

If plasma is used for film formation, then film formation rate increases, but plasma damage to the substrate occurs

Engineering Contradiction:
Improvefilm formation rateVSAvoidsubstrate damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The pseudo-catalyst acts as an intermediary that enables high film formation rates without requiring plasma. The halogen compound or boron compound facilitates the decomposition and reaction of the organic-based source, achieving high productivity while avoiding the harmful plasma effects on the substrate.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention substitutes the plasma mechanism (electromagnetic field-based) with a chemical catalysis mechanism. By using the pseudo-catalyst to promote chemical reactions, the system achieves high film formation rates without the mechanical/electromagnetic stress and damage associated with plasma processing.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables flexible control over film formation rate, temperature, and properties, even with a single species of organic-based source, improving film quality and reducing manufacturing costs by preventing plasma damage and optimizing substrate processing.

Implementation Method 1

supplying an organic-based source containing a prescribed element, and a pseudo catalyst including at least one selected from the group consisting of a halogen compound and a boron compound, into a process chamber in which the substrate is housed, and confining the organic-based source and the pseudo catalyst in the process chamber

Methodology Applied
Scientific EffectCatalysis: Catalysis

Implementation Method 2

maintaining a state in which the organic-based source and the pseudo catalyst are confined in the process chamber

Methodology Applied
Scientific EffectThermal decomposition: Pyrolysis

Data Source

PatentUS9831083B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
Publication Date: 2017.11.28 KOKUSAI DENKI KK
  • US9831083B2 patent drawing
  • US9831083B2 patent drawing
  • US9831083B2 patent drawing

AI summary

A film containing a prescribed element and carbon is formed on a substrate, by performing a cycle a prescribed number of times, the cycle including: supplying an organic-based source containing a prescribed element and a pseudo catalyst including at least one selected from the group including a halogen compound and a boron compound, into a process chamber in which the substrate is housed, and confining the organic-based source and the pseudo catalyst in the process chamber; maintaining a state in which the organic-based source and the pseudo catalyst are confined in the process chamber; and exhausting an inside of the process chamber.