Pseudo-Homogeneous Photo-Patternable Blends for Damage-Free OTFT Patterning

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Solution Overview

Problem

Conventional photolithographic processes for manufacturing inorganic TFT device arrays cause damage to organic semiconductor layers due to harsh oxygen plasma and aggressive solvents, leading to device performance deterioration.

Innovation Solution

Development of pseudo-homogeneous photo-patternable semiconducting polymer blends comprising diketopyrrolopyrrole-fused thiophene polymeric materials, which can be used in organic thin-film transistors, offering isotropic charge mobility and suitable for bottom-gate bottom-contact configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional photolithographic processes are used for manufacturing inorganic TFT device arrays, then patterning precision is improved, but the organic semiconductor layer is damaged due to harsh oxygen plasma and aggressive solvents

Engineering Contradiction:
Improvepatterning precisionVSAvoiddamage to organic semiconductor layer
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an organic-inorganic hybrid interface layer as an intermediary between the inorganic TFT structure and the organic semiconductor material. This hybrid layer acts as a buffer that protects the organic semiconductor from harsh processing conditions (oxygen plasma and aggressive solvents) while maintaining electrical functionality. The hybrid interface mediates the interaction between incompatible materials, enabling photolithographic patterning without direct exposure of the organic layer to damaging conditions.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite material structures combining organic and inorganic components in a hybrid TFT architecture. The device structure integrates inorganic semiconductors for the active channel with organic materials for the gate dielectric and interface layers. This composite approach allows the use of robust inorganic materials that can withstand photolithographic processing while organic materials provide protection and compatibility with the semiconductor layer, resolving the contradiction between patterning precision and layer damage.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If harsh oxygen plasma and aggressive solvents are used during photolithography, then pattern transfer accuracy is improved, but device performance deteriorates due to damage to the OSC layer

Engineering Contradiction:
Improvepattern transfer accuracyVSAvoiddevice performance
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The organic-inorganic hybrid interface layer serves as a protective intermediary that allows pattern transfer processes to proceed with high accuracy while preventing direct contact between harsh chemicals/plasma and the organic semiconductor layer. The hybrid interface absorbs the mechanical and chemical stress of photolithography, maintaining pattern transfer accuracy without transmitting damage to the sensitive OSC layer, thus preserving device performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent implements a protective hybrid interface structure beforehand, before the photolithographic process begins. This pre-established protective layer cushions the organic semiconductor against subsequent exposure to harsh oxygen plasma and aggressive developing solvents. The cushioning effect is built into the device architecture in advance, ensuring that when pattern transfer occurs, the OSC layer is already protected and will not suffer performance deterioration.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Manufacturing precision

If conventional inorganic TFT manufacturing processes are used, then manufacturing precision is improved, but process complexity increases due to high temperature and high vacuum deposition requirements

Engineering Contradiction:
Improvedevice fabrication precisionVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent fundamentally changes the processing parameters from conventional inorganic TFT manufacturing. Instead of requiring high temperature (typically >400°C) and high vacuum deposition processes, the hybrid organic-inorganic structure enables low-temperature processing (below 150°C) using solution-based techniques and ambient pressure methods. This parameter change simplifies the manufacturing equipment requirements and reduces process complexity while maintaining fabrication precision through the protective hybrid interface that enables gentle processing conditions.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The polymer blends provide improved device performance with isotropic charge mobility and stability, enabling precise patterning without damaging the OSC layer, thus enhancing the reliability and efficiency of organic thin-film transistors.

Implementation Method 1

pseudo-homogeneous photo-patternable semiconducting polymer blends

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS20250318420A1Pseudo-homogeneous photo-patternable semiconducting polymer blends for organic thin-film transistors (OTFT)
Publication Date: 2025.10.09 CORNING INC
  • US20250318420A1 patent drawing
  • US20250318420A1 patent drawing
  • US20250318420A1 patent drawing

AI summary

A semiconductor device, including at least one organic semiconductor (OSC) polymer and at least one photosensitizer, such that the at least one OSC polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, and the fused thiophene is beta-substituted.