Pseudo Waveguide Via Structure for Low-Loss Signal Transmission
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Solution Overview
Problem
Conventional techniques using pseudo waveguides in collective lamination substrates face increased transmission loss due to dielectric filling, leading to reduced signal transmission efficiency compared to hollow waveguides, and are complicated by the need for multiple substrate attachments which can result in assembly errors affecting apparatus characteristics.
Innovation Solution
A collective lamination substrate with pattern layers and a pseudo waveguide formed through these layers, featuring a first and second via group forming a doubled circular structure around the waveguide, with ground patterns and converter sections to minimize transmission loss by optimizing via placement and diameter for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a pseudo waveguide is used in a collective lamination substrate, then the structure is simplified and manufacturing is easier, but transmission loss increases due to dielectric filling
Solution Approach 1:
The patent changes the physical parameters of the via holes by forming an metallic reflective film on the inner walls, transforming them from simple dielectric-filled holes into effective electromagnetic waveguides. This parameter change (adding reflective coating) reduces transmission loss while maintaining the simplified single-substrate structure.
Solution Approach 2:
The patent creates a composite structure by combining the via hole geometry with a metallic reflective film coating. This composite approach (dielectric + metallic lining) allows the pseudo waveguide to achieve low transmission loss characteristics similar to hollow waveguides while maintaining the manufacturing simplicity of integrated substrate structures.
2Loss of energy
If two substrates are attached to form a hollow waveguide, then transmission loss is reduced, but manufacturing complexity and assembly errors increase
Solution Approach 1:
The patent merges the waveguide structure directly into the collective lamination substrate by forming via holes through the substrate layers. This integration eliminates the need for separate substrate attachment processes, reducing manufacturing complexity and assembly errors while maintaining effective waveguide functionality through the metallic reflective coating.
Solution Approach 2:
The patent creates a pseudo waveguide that copies the essential electromagnetic wave transmission functionality of a hollow waveguide, but implements it within the substrate using via holes with metallic reflective films instead of requiring actual hollow cavity structures across multiple substrates.
3Ease of manufacture
If a pseudo waveguide with dielectric filling is used, then manufacturing is simplified, but transmission efficiency decreases
Solution Approach 1:
The patent changes the electromagnetic parameters of the via hole structure by adding a metallic reflective film with high conductivity. This parameter change transforms the via hole from a high-loss dielectric-filled structure into an efficient waveguide that maintains transmission efficiency while keeping the manufacturing process simple and integrated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces transmission loss in the pseudo waveguide, achieving a passing loss of 2.5 dB or less and reflection loss of −10 dB or less at frequencies up to 81 GHz, improving signal transmission efficiency and simplifying the manufacturing process by eliminating the need for multiple substrate attachments.
Implementation Method 1
a converter section which mutually converts between an electrical signal flowing through the transmission line and radio waves being transmitted and received via the pseudo waveguide
Implementation Method 2
a converter section which mutually converts between an electrical signal flowing through the transmission line and radio waves being transmitted and received via the pseudo waveguide
Implementation Method 3
a first via group is provided in a periphery of the waveguide formation section, composed of a plurality of vias that establish conduction between a ground pattern formed in the first layer of the pattern layers and a ground pattern formed in the second layer of the pattern layers
Data Source
AI summary
A collective lamination substrate N is provided with pattern layers having N number of layers, where N is an integer and 4 or more, a pseudo waveguide formed penetrating through the pattern layers in a lamination direction, a converter section formed in the pattern layers, mutually converting between an electrical signal and radio waves being transmitted and received via the pseudo waveguide, and ground patterns formed in the pattern layers, covering a periphery of a waveguide formation section. The collective lamination substrate further includes: antennas formed in the waveguide formation section; a first via group provided in a periphery of the waveguide formation section; and a second via group provided in a periphery of the waveguide formation section and positioned at a more outer portion than the first via group.