Computer Power Supply Housing With Five-Sided Passive Cooling

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Solution Overview

Problem

Computer power supply units (PSUs) face challenges in efficiently dissipating heat from high heat-producing components due to limited space and increased power demands, leading to potential overheating, malfunction, and permanent damage, with existing cooling methods like heatsinks and fans having reliability issues and space constraints.

Innovation Solution

A computer power supply unit design featuring a housing with thermally conductive materials and a heat transfer system comprising bottom and top heat transfer devices, including heatsinks and heat pipes, providing five-sided cooling to maximize heat dissipation efficiency and reliability, minimizing the risk of inadequate power supply and component damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heatsink size is increased to improve heat dissipation, then cooling efficiency is improved, but device volume and clearance space are exceeded

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidPSU form factor dimension

Core Design Contradiction:

TemperatureVSVolume of stationary object

Solution Approach 1:

The heat pipes are embedded within the housing structure itself, nesting the heat transfer function inside the existing form factor without requiring additional external space. The housing panels serve dual purposes as both structural elements and heat dissipation surfaces.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention utilizes the housing panels (top, bottom, sides) as heat dissipation surfaces, transitioning from traditional internal heatsink placement to external surface utilization, effectively adding dimensional capacity for heat dissipation without increasing internal volume.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If built-in fans are used to enhance convection cooling, then heat dissipation is improved, but reliability decreases due to dust intake and maintenance requirements

Engineering Contradiction:

Improveheat dissipationVSAvoidfan maintenance and dust intake

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The invention removes the active fan component from the cooling system, extracting the reliability problem associated with moving parts, dust intake, and maintenance requirements while retaining passive heat dissipation capability through the housing panels.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The housing panels with embedded heat pipes provide self-service cooling through passive convection and radiation, eliminating the need for external power sources, control systems, or maintenance interventions that would be required for active fan-based cooling.

Inventive Principle:

Principle #25Self-service

3Temperature

If fan rotation speed is increased to handle higher power loads, then heat dissipation is improved, but noise and vibration increase

Engineering Contradiction:

Improveheat dissipation under loadVSAvoidnoise and vibration

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The invention replaces the mechanical fan rotation system with a passive thermal conduction and convection system based on embedded heat pipes, eliminating the source of noise and vibration while maintaining heat dissipation capability under varying power loads.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances cooling efficiency, increases reliability, and reduces the likelihood of overheating and component failure by effectively dissipating heat through a five-sided cooling system, ensuring adequate power supply to heat-producing components.

Implementation Method 1

the housing is formed from a thermally conductive material... The bottom heat transfer device is in thermal communication with the at least one high heat solder... A bottom thermal path is formed between the bottom heat transfer device and the bottom panel to dissipate heat

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat transfer system including a bottom heat transfer device and a top heat transfer device... A bottom thermal path is formed between the bottom heat transfer device and the bottom panel to dissipate heat... A top thermal path is formed between the top heat transfer device and the top panel to dissipate heat

Methodology Applied

Scientific EffectHeat transfer: Heat Exchanger

Data Source

PatentUS20260040511A1Computer power supply unit

Publication Date: 2026.02.05 COOLER MASTER TECH

AI summary

A computer power supply unit including a housing, a main board disposed in the housing, at least one high heat producing component disposed on the main board, at least one other heat producing component disposed on the main board, and a heat transfer system is provided. The heat transfer system comprises bottom and top heat transfer devices. Thermal paths are formed between the bottom heat transfer device and a bottom panel of the housing and the top heat transfer device and a top panel of the housing to dissipate heat from an at least one high heat component assembly, formed in part by the at least one high heat producing component, and an at least one other heat component assembly, formed in part by the at least one other heat producing component, to an outside of the bottom panel and an outside of the top panel.