PSU Interconnect Scheme for Low Voltage Drop
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current power supply units (PSUs) for computers suffer from inefficiencies due to high voltage drops in AC interconnects, primarily caused by insufficient cable diameter and high contact resistance in connectors, leading to power losses and reduced efficiency ratings.
Innovation Solution
The implementation of advanced AC and DC interconnect schemes using low-gauge wire and connectors with low contact resistance, such as IEC 60309 for AC interconnects and terminal blocks, circular, and rectangular connectors for DC modular cables, reduces voltage drops and heat dissipation, enhancing overall efficiency and compatibility with international electrical standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If IEC 60320 C13/C14 connectors are used for AC power input, then compatibility with standard power cords is achieved, but voltage drops and power losses increase significantly at high currents
Solution Approach 1:
The patent segments the AC power input interface into multiple separate connectors (e.g., L1, N1, PE1 for live, neutral, and ground) that can be distributed across different locations on the PSU housing. This allows the use of standard IEC 60320 C13/C14 power cords while reducing the current density and voltage drops in each individual connector, thereby maintaining compatibility without the associated power losses.
Solution Approach 2:
The patent introduces intermediate connection points and internal wiring arrangements that act as mediators between the external power cord and the internal power distribution system. By using multiple intermediate connectors and optimizing the internal interconnect path, the system reduces the effective resistance and voltage drops while maintaining compatibility with standard external power interfaces.
2Ease of operation
If modular DC cables with standard connectors are used, then ease of connection is improved, but contact resistance and series resistance are too high causing significant power losses
Solution Approach 1:
The patent changes the electrical parameters of the DC connector system by using low-gauge wire (e.g., 12 AWG or lower) with reduced resistance and designing connectors with optimized contact surfaces and materials. This reduces both series resistance in the cable and contact resistance at the connectors, thereby reducing power losses while maintaining the modular cable's ease of connection.
Solution Approach 2:
The patent employs composite material structures in the connector design, combining different materials with complementary properties (e.g., gold-plated contacts for low contact resistance, reinforced insulation for mechanical durability) to achieve both ease of connection and minimal power losses in the modular DC cable system.
3Ease of manufacture
If bundles of wires are used to connect PSU circuit boards, then manufacturing simplicity is maintained, but connection reliability and current handling capability are insufficient
Solution Approach 1:
The patent merges multiple separate wire connections into integrated connector assemblies where the electrical connections and mechanical mounting are combined into a single unified component. This integration improves connection reliability and current handling capability while maintaining manufacturing simplicity through standardized assembly procedures.
Solution Approach 2:
The patent replaces traditional mechanical wire bundles with rigid PCB traces or rigidized interconnect structures that provide more reliable and consistent electrical connections. This substitution maintains ease of manufacture through standardized PCB fabrication processes while significantly improving connection reliability and current handling capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These interconnect schemes significantly reduce power losses and heat dissipation, increasing the efficiency of PSUs by minimizing voltage drops and improving current handling capabilities, thus enhancing the performance and reliability of power supply units for computers.
Implementation Method 1
The voltage drops in the IEC320 power cord are a result of the use of cable with insufficient diameter (the AWG rating and resistance is too high); The voltage drops in the IEC320 inlet originate from high contact resistance between the inlet and the mating end of the power cord
Implementation Method 2
This results in a power loss of approximately 11.5 watts which is roughly equivalent to a 0.7% penalty in the overall efficiency ratings of a 1200 watt, 87% efficient PSU
Data Source
AI summary
An ATX compatible power supply unit having a main printed circuit board and at least one connector printed circuit board that includes at least one outlet connector for use with a DC modular cable, the at least one connector printed circuit board is connected to the main printed circuit board with connectors other than bare or insulated wires to allow high currents to be transferred between the at least one connector printed circuit board and the main printed circuit board at low voltage drops is disclosed.