PSVA Pad Reduction via Switch Element Merging
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Solution Overview
Problem
The complexity of peripheral routes and increased probability of bad contacts in liquid crystal display panel manufacturing due to a large number of pads and probes during the PSVA process lead to defects and higher design complexity.
Innovation Solution
A substrate and manufacturing method that reduces the number of pads in peripheral routes by using a checkerboard arrangement of data and scan lines, with a simplified PSVA mode pad set comprising only a data scan pad and a common electrode pad, along with switch elements that connect and disconnect using a hard seal material to establish electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of areas and signal types is increased, then the display panel functionality is improved, but the number of pads and probes increases leading to higher defect rate
Solution Approach 1:
The patent merges multiple pad functions into a unified PSVA mode pad set located at the border of the glass substrate. Instead of having separate pads for each signal type, the design combines scan lines, data lines, and common electrode connections into a single integrated pad structure, reducing the total number of contact points and thereby lowering the defect rate while maintaining full functionality.
Solution Approach 2:
The PSVA mode pad set is designed as a universal structure that serves multiple functions simultaneously. It can connect to different signal types (scan lines, data lines, common electrodes) through a single pad location, allowing one pad structure to perform multiple electrical connection roles, thus reducing the overall number of pads required across the substrate.
2Adaptability or versatility
If the number of pads in peripheral routes is increased, then the electrical connection coverage is improved, but the design complexity and manufacturing difficulty increase
Solution Approach 1:
The patent consolidates multiple peripheral route connections into a single PSVA mode pad set located at the border of the glass substrate. This merging approach maintains comprehensive electrical connection coverage while significantly reducing the number of separate pad structures and peripheral routes that need to be designed and manufactured.
Solution Approach 2:
The patent extracts the essential connection function from multiple distributed pads and concentrates it into a single unified PSVA mode pad set. By taking out the core electrical connection capability and placing it in one location, the design eliminates redundant peripheral pad structures and simplifies the overall routing complexity.
3Measurement precision
If the number of probes for PSVA test is increased, then the testing coverage is improved, but the probability of bad contact and curing anomaly increases
Solution Approach 1:
The patent merges multiple test probe connections into a single PSVA mode pad set, reducing the total number of probe contact points. This consolidation maintains comprehensive testing coverage while lowering the probability of bad contacts and curing anomalies, as fewer connection points mean fewer opportunities for defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the number of test probes and simplifies the peripheral routes, improving the yield rate of the PSVA process by minimizing defects and design complexity.
Implementation Method 1
an insulation layer, disposed between the first metal layer and the second metal layer; wherein before cell process, the insulation layer insulating the first metal layer and the second metal layer from each other to realize selection of electrical connection or disconnection between the switch element and a scan line, a data line or a common electrode line
Implementation Method 2
during cell process, applying hard seal material to overlapping area of the first metal layer and the second metal layer so that the insulation layer being broken during pressing seal material to result in electrical connection between the first metal layer and the second metal layer
Data Source
AI summary
The present invention provides a substrate for array process of panel display device, which includes a cell switch set and a PVSA mode pad set. Cell switch set includes a plurality of switch elements. PSVA mode pad set includes a data scan pad and a common electrode pad. Data scan pad is connected through some switch elements of cell switch set to a plurality of scan lines and data lines. Common electrode pad is connected through switch element to common electrode line in the area. The present invention further provides a panel display device and manufacturing method of liquid crystal display panel. In this manner, the present invention reduces the number of pads in PSVA mode pad set to simplify peripheral routes.