PTC Heating Element Induction Soldering for Compact Thermal Bonding
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Solution Overview
Problem
Existing manufacturing processes for Positive Temperature Coefficient (PTC) heating elements are inefficient and costly, lacking a simple and effective method for establishing a permanent mechanical and electrical connection while ensuring good heat dissipation.
Innovation Solution
A process involving the application of solder material between a PTC component and a carrier, followed by induction soldering to create a permanent mechanical and electrical connection, with optional metallic coatings for enhanced adhesiveness and using ceramic or metallic carriers for insulation and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional manufacturing processes are used for PTC heating elements, then the connection process requires complex additional means and multiple steps, but this increases device complexity and manufacturing cost
Solution Approach 1:
The patent merges the mechanical connection function and electrical connection function into a single solder material layer. The solder material simultaneously provides mechanical bonding between the PTC component and carrier, and establishes electrical conductivity, eliminating the need for separate mechanical fasteners and electrical contacts, thus simplifying the overall structure and manufacturing process
Solution Approach 2:
The solder material is designed to perform multiple functions: mechanical connection, electrical conduction, and heat dissipation. This multi-functional approach replaces traditional multi-component assembly systems with a single universal material that accomplishes all connection requirements, reducing device complexity and manufacturing steps
2Stability of the object's composition
If solder material is used to establish mechanical and electrical connection, then the structure becomes compact and thermally stable, but additional means are required beyond traditional connection methods
Solution Approach 1:
The patent combines mechanical fastening and electrical connection into a single solder joint, eliminating the need for separate components. The solder material forms an integrated connection structure that provides both mechanical strength and electrical conductivity, resulting in a compact design with improved thermal stability while reducing overall structural complexity
3Productivity
If induction soldering is used to melt solder material uniformly, then energy is efficiently distributed over larger surface area, but additional equipment is required compared to traditional soldering methods
Solution Approach 1:
The patent replaces traditional thermal conduction soldering (which requires direct contact heating elements) with induction soldering that uses electromagnetic fields to heat the solder material. This substitution enables uniform energy distribution over larger surface areas, improves soldering efficiency and productivity, while the induction heating system provides precise control with relatively simple equipment configuration
4Reliability
If the solder material establishes both mechanical connection and electrical conductivity, then heat dissipation is improved, but the manufacturing process requires precise control of melting and cooling
Solution Approach 1:
The induction soldering process incorporates feedback control mechanisms that monitor the heating process in real-time. The system adjusts the electromagnetic field parameters based on feedback signals to maintain optimal melting temperature, ensuring uniform solder flow and proper wetting of the PTC component and carrier surfaces. This feedback control achieves precise thermal management, producing reliable mechanical and electrical connections with consistent heat dissipation performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process results in a compact, thermally stable PTC heating element with efficient heat dissipation and electrical conductivity, achieved through a simple and cost-effective manufacturing method.
Implementation Method 1
melting of the solder material by induction soldering
Data Source
AI summary
A process manufactures a PTC heating element (10) that includes at least one PTC component (20) and, on at least one side (50, 52) of the at least one PTC component (20), at least one carrier (14, 16) permanently connected to the PTC component (20). The process includes arranging solder material (46, 48) between the one side of the at least one PTC component (20), which side is to be permanently connected to the at least one carrier (14, 16), and the at least one carrier to be connected on this side of the at least one PTC component (20). The solder material (46, 48) is melted by induction soldering to connect the at least one PTC component (20) to the at least one carrier (14, 16).