PTC Over-Current Protection Device Using Ceramic Fillers

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Solution Overview

Problem

Over-current protection devices using carbon black as conductive fillers struggle to meet requirements for high temperature environments, such as automotive applications, due to low heat dissipation efficiency and rapid time-to-trip issues, while nickel powder is not viable due to hydrofluoric acid generation.

Innovation Solution

Incorporating a fluorine-containing crystalline polymer and a conductive ceramic filler, such as titanium carbide, into the PTC material layer to enhance heat dissipation efficiency and increase hold current, ensuring reliable operation at high temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If carbon black is used as conductive filler, then the device can be manufactured, but the hold current is small and heat dissipation efficiency is poor

Engineering Contradiction:
Improvehold currentVSAvoidheat dissipation efficiency
Core Design Contradiction:
Quantity of substanceVSLoss of energy

Solution Approach 1:

The patent changes the material parameters by replacing carbon black with conductive ceramic fillers (titanium carbide, zirconium carbide, or hafnium carbide) that have superior electrical conductivity and thermal properties. This material substitution directly increases hold current and improves heat dissipation efficiency without compromising device functionality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite material system combining fluorine-containing crystalline polymer matrix with conductive ceramic filler particles. This composite structure leverages the polymer's stability at high temperatures and the ceramic's conductivity to achieve both high hold current and effective heat dissipation simultaneously

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If nickel powder is used as conductive filler, then heat dissipation may improve, but hydrofluoric acid is generated at high temperature

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidhydrofluoric acid generation
Core Design Contradiction:
Loss of energyVSObject-generated harmful factors

Solution Approach 1:

The patent avoids the harmful reaction by selecting ceramic fillers that do not react with fluorine-containing polymers at high temperatures. This converts the potential harmful interaction into a stable, non-reactive composite system that maintains heat dissipation efficiency without generating toxic substances

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent selects ceramic materials that are chemically inert and stable under operating conditions, replacing the reactive nickel powder. These ceramic fillers provide durable, long-lasting performance without degradation or harmful byproduct generation

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Reliability

If the device is designed for high temperature environments, then reliability improves, but time-to-trip becomes too fast under high current

Engineering Contradiction:
Improvehigh temperature operation capabilityVSAvoidtime-to-trip
Core Design Contradiction:
ReliabilityVSDuration of action of moving object

Solution Approach 1:

The patent modifies the PTC material's electrical parameters by optimizing the conductive filler content and distribution. This creates a balanced temperature-resistance characteristic that provides sufficient heat dissipation capability at high temperatures while maintaining appropriate trip response time under over-current conditions

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively increases hold current and improves heat dissipation efficiency, meeting the requirements for high-temperature environments by maintaining sufficient current without tripping and ensuring rapid heat dissipation, with the fluorine-containing polymer maintaining performance up to 80°C.

Implementation Method 1

the conductive ceramic filler is 40-65% by volume of the PTC material layer, and has a volume resistivity less than 500 μΩ-cm

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the resistance of the PTC material layer remains extremely low at normal temperature, so that the circuit or cell can operate normally. However, when an over-current or an over-temperature event occurs in the circuit or cell, the resistance will instantaneously increases to a high resistance state

Methodology Applied
Scientific EffectPositive temperature coefficient effect: Thermistor

Implementation Method 3

the fluorine-containing crystalline polymer has a higher melting point in comparison with polyethylene (PE); thus devices containing fluorine-containing crystalline polymer can still maintain a sufficient hold current in a high-temperature environment, e.g., 80° C. in a motor vehicle, so as to have the feature of rapid heat dissipation

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7286038B1Over-current protection device
Publication Date: 2007.10.23 POLYTRONICS TECH CORP
  • US7286038B1 patent drawing
  • US7286038B1 patent drawing
  • US7286038B1 patent drawing

AI summary

An over-current protection device comprises two metal foils and a positive temperature coefficient (PTC) material layer laminated between the two metal foils. The PTC material layer includes: (1) a polymer substrate, being 35-60% by volume of the PTC material layer and including a fluorine-containing crystalline polymer with a melting point higher than 150° C., e.g., polyvinylidine fluoride (PVDF); and (2) a conductive ceramic filler (e.g., titanium carbide) distributed in the polymer substrate. The conductive ceramic filler is 40-65% by volume of the PTC material layer, and has a volume resistivity less than 500 μΩ-cm. The volume resistivity of the PTC material layer is less than 0.1 Ω-cm, and the ratio of the hold current of the PTC material layer at 25° C. to the area of the PTC material layer is between 0.05 and 0.2 A/mm2.