Ptychographic Reflection-Mode Electron-Beam Inspection
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Solution Overview
Problem
Current semiconductor inspection technologies face challenges in achieving high-resolution imaging with high throughput, particularly due to limitations in reflective particle-beam projection-imaging systems which are sensitive to aberrations and struggle with extending finite boundary constraints of samples.
Innovation Solution
The implementation of a ptychographic inspection system using reflective particle-beam imaging that generates high-resolution output images by combining diffraction-plane images with phase information from sample-plane images, overcoming aberrations and finite boundary constraints through overlapping sample regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If reflective particle-beam projection-imaging is used for semiconductor inspection, then imaging speed and throughput are improved, but image resolution deteriorates due to sensitivity to aberrations
Solution Approach 1:
The imaging process is segmented into multiple discrete steps: acquiring a first image at the sample plane, acquiring a second image at the diffraction plane, and then computationally combining these images. This segmentation allows each image to be optimized for its specific purpose (throughput for sample plane, resolution for diffraction plane) while the combination resolves the contradiction between speed and resolution.
Solution Approach 2:
The diffraction plane image serves as an intermediary that contains high-resolution information about the sample. By capturing this intermediate representation and combining it with the sample plane image, the system recovers high-resolution details that would otherwise be lost in direct reflective imaging, thus resolving the resolution degradation caused by aberrations.
2Productivity
If direct sample-plane imaging is used, then image acquisition is simple and fast, but finite boundary constraints limit the inspectable sample area
Solution Approach 1:
The system transitions from purely spatial imaging to a combined spatial-frequency domain approach. By capturing images at both the sample plane (spatial domain) and diffraction plane (frequency domain), the system gains access to additional information dimensions that enable extended sample area inspection while maintaining acquisition efficiency.
3Measurement precision
If high-resolution imaging is pursued through traditional methods, then image quality improves, but inspection throughput decreases
Solution Approach 1:
The system performs preliminary acquisition of both sample plane and diffraction plane images simultaneously or in rapid succession. By preparing both datasets in advance and then combining them computationally, the system avoids the need for slow, sequential high-resolution scanning, thus maintaining high throughput while achieving superior resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the generation of high-resolution images with improved throughput, capable of handling extended samples by supplementing diffraction-plane images with phase information from sample-plane images, resulting in higher resolution than directly-generated sample-plane images.
Implementation Method 1
a reflective particle-beam imaging system providing an image of a selected portion of a sample and a diffraction pattern of the selected portion of the sample
Data Source
AI summary
A particle-beam inspection system may include a reflective particle-beam imaging system providing an image of a selected portion of a sample and a diffraction pattern of the selected portion of the sample and a controller communicatively coupled to the reflective particle-beam imaging system. The controller may receive two or more sample-plane images from the reflective particle-beam imaging system associated with two or more selected portions of the sample, where at least some of the two or more selected portions of the sample overlap. The controller may further receive two or more diffraction-plane images from the reflective particle-beam imaging system associated with the two or more selected portions of the sample. The controller may further construct one or more output images of the two or more selected portions of the sample from the two or more diffraction-plane images using phase information obtained from the two or more sample-plane images.