PUF Generator Layout Using Random Short Circuits for Reliability

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Solution Overview

Problem

The existing PUF generators face challenges in improving reliability and reducing manufacturing costs.

Innovation Solution

A PUF generator design featuring semiconductor units with isolation structures, conductive lines, and randomly occurring short circuits between these lines, facilitated by manufacturing variations, to generate a unique random code.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional PUF generator designs are used, then manufacturing cost is reduced, but reliability is insufficient

Engineering Contradiction:
ImprovePUF generator reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent converts the harmful effect of manufacturing variations and random defects into a beneficial feature by intentionally designing conductive lines that may randomly short-circuit during fabrication. These random short circuits between first and second conductive lines create unique PUF codes that improve reliability while using standard manufacturing processes

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The PUF generator utilizes the self-organizing property of manufacturing variations to automatically generate unique identification codes. The random short circuits occur naturally during fabrication without additional processing steps, allowing the system to self-generate secure keys through the inherent variability of the manufacturing process

Inventive Principle:
Principle #25Self-service

2Reliability

If manufacturing variations are exploited to generate random codes, then uniqueness is achieved, but reliability is insufficient

Engineering Contradiction:
ImprovePUF generator reliabilityVSAvoidprocess variation
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent transforms the precision problem into a solution by designing conductive lines that intentionally rely on manufacturing variations. The first and second conductive lines are positioned such that random short circuits during fabrication create unique PUF codes, converting process imprecision into a reliable source of entropy

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If complex PUF generator structures are used, then reliability is improved, but manufacturing cost increases

Engineering Contradiction:
ImprovePUF generator reliabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the PUF generation function with standard semiconductor manufacturing processes. The conductive lines are formed using conventional fabrication steps, and the isolation structures are integrated into the substrate, allowing PUF functionality to be combined with existing manufacturing workflows without adding significant complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The conductive lines serve multiple functions: they provide electrical connectivity for normal circuit operation and simultaneously serve as the PUF code generation mechanism through random short circuits. This multi-functionality eliminates the need for separate PUF-specific structures, reducing overall manufacturing complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12412848B2Physical unclonable function generator and manufacturing method thereof
Publication Date: 2025.09.09 UNITED MICROELECTRONICS CORP
  • US12412848B2 patent drawing
  • US12412848B2 patent drawing
  • US12412848B2 patent drawing

AI summary

A physical unclonable function (PUF) generator including a substrate and semiconductor units is provided. Each of the semiconductor units includes an isolation structure, a first conductive line, and a second conductive line. The isolation structure is located in the substrate. The isolation structure has a first protrusion portion and a recess. The first protrusion portion and the recess are adjacent to each other. The first conductive line is located above the first protrusion portion and the recess. The second conductive line is located above the first conductive line. At least one short circuit randomly exists between at least one of the first conductive lines and at least one of the second conductive lines in at least one of the semiconductor units.