Pulsating Heat Pipe Module With Protruding Ribs for Better Cooling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing electronics modules with pulsating heat pipes struggle to achieve efficient cooling due to limitations in heat transfer surface area and thermal conductivity.

Innovation Solution

The introduction of ribs into the main body of the pulsating heat pipe, which protrude beyond the surface, increases the heat transfer surface area and utilizes materials with higher thermal conductivity than the main body, such as metallic or ceramic materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the heat transfer surface area of the pulsating heat pipe is increased, then heat transfer efficiency is improved, but device complexity increases

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent extends the heat transfer surface area by adding ribs that protrude in the radial direction from the main body, transitioning from a two-dimensional surface to a three-dimensional structure. This dimensional extension increases the heat transfer area without requiring a larger overall volume, effectively resolving the contradiction between heat transfer efficiency and device complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The ribs are pre-integrated into the main body of the pulsating heat pipe as a fixed structural feature, rather than being added as separate components during operation. This preliminary integration of heat transfer enhancement features simplifies the overall device assembly while maintaining improved heat transfer efficiency.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If ribs made of materials with higher thermal conductivity are introduced, then heat conduction is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveheat conductionVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs composite construction by integrating ribs made of materials with higher thermal conductivity (such as metal or ceramic) into the main body. This composite approach allows different materials to be used for different functional requirements: the main body provides structural integrity while the ribs provide enhanced heat conduction pathways.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The ribs are strategically positioned at specific locations where heat dissipation is most critical, rather than uniformly distributing the high-conductivity material throughout the entire device. This localized application of high-performance materials optimizes heat conduction where needed most while minimizing manufacturing complexity and material costs.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat transfer efficiency, allowing for improved cooling of electronic components by increasing the surface area for heat dissipation and leveraging the higher thermal conductivity of the ribs.

Implementation Method 1

a heat transfer medium that forms alternating vapor segments and liquid segments along the channel structure due to the surface tension of the heat transfer medium

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Implementation Method 2

At a heat source, the vapor segments expand because of the higher temperature; moreover, liquid heat transfer medium boils there and absorbs latent heat

Methodology Applied
Scientific EffectBoiling: Boiling

Implementation Method 3

At a heat sink, the vapor segments shrink due to condensation of the gaseous heat transfer medium and in this case give off latent heat

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 4

The local temperature and pressure differences drive the constant pulsation or oscillation of the vapor and liquid segments

Methodology Applied
Scientific EffectTemperature gradient: Temperature Gradient

Data Source

PatentUS20250157878A1Electronics module comprising a pulsating heat pipe with a channel structure
Publication Date: 2025.05.15 SIEMENS AG
  • US20250157878A1 patent drawing
  • US20250157878A1 patent drawing
  • US20250157878A1 patent drawing

AI summary

An electronics module includes a pulsating heat pipe having a main body and a channel structure which is at least partially formed in the main body and in which a heat transfer medium is arranged. The main body includes a recess and is made at least partially of a dielectric material. An electronic component is thermally conductively connected to the heat transfer medium and designed as a vertical power semiconductor. A metal rib is secured in the recess and designed to protrude over a surface of the main body. The metal rib is in direct contact with the heat transfer medium.