Pulsating Heat Pipe Support Device for Power Module Thermal Management

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Solution Overview

Problem

Existing power-electrical circuits face challenges in cost-effective and reliable thermal management of electrically conductive connection elements, particularly in maintaining low wear and efficient heat dissipation while minimizing the use of costly materials with high thermal conductivity.

Innovation Solution

A support device incorporating pulsating heat pipes made from partially electrically insulating plastic, with a diffusion-inhibiting coating and a hybrid thermal conductivity structure, provides mechanical support to electrically conductive connection elements, enabling efficient heat transport and isolation from electrical interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cost-intensive materials with high thermal conductivity are used for the support device, then heat dissipation efficiency is improved, but manufacturing cost increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The support device is divided into functionally distinct regions: a central region made of electrically insulating plastic with reduced thermal conductivity for electrical isolation, and end regions made of material with increased thermal conductivity for efficient heat transfer. This segmentation allows each region to be optimized for its specific function without requiring the entire device to use expensive high thermal conductivity materials.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the support device are assigned different thermal conductivity properties tailored to their functional requirements. The central region uses material with reduced thermal conductivity (0.2-2.0 W/(m·K)) for electrical insulation, while the end regions use material with increased thermal conductivity (≥2.0 W/(m·K)) for heat dissipation, achieving local optimization of thermal properties.

Inventive Principle:
Principle #3Local quality

2Device complexity

If the support device provides both mechanical support and heat dissipation functions, then device complexity is reduced, but thermal management performance may be compromised

Engineering Contradiction:
Improvedevice integrationVSAvoidthermal management performance
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The support device simultaneously performs multiple functions: mechanical support of the connecting element, electrical insulation between the connecting element and heat sink, and heat dissipation from the connecting element to the heat sink. The hybrid material structure enables this multi-functionality by combining electrically insulating plastic for support and insulation with thermally conductive material for heat transfer.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If the pulsating heat pipe is left uncoated, then manufacturing simplicity is maintained, but contamination of the fluid occurs reducing service life

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidservice life
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A diffusion-inhibiting coating is applied to the pulsating heat pipe to prevent contamination of the fluid by water vapor or gases from ambient air. The coating acts as a protective barrier that maintains fluid purity and extends the operational service life of the heat pipe system.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution offers a cost-effective, low-wear, and efficient thermal management system for power-electrical circuits by utilizing pulsating heat pipes for heat transport and minimizing thermal conductivity material usage, while ensuring electrical insulation and extended lifespan through reduced contamination risks.

Implementation Method 1

at least one pulsating heat pipe is formed in the support device, through which heat can be transported from the connecting element to the heat sink

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

The pulsating heat pipe provides efficient heat dissipation that operates automatically

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 3

The pulsating heat pipe is further geometrically adaptable and can thus be integrated into a variety of different types of support devices

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 4

The at least one pulsating heat pipe is at least partially provided with a diffusion-inhibiting coating. The diffusion-inhibiting coating is designed to prevent the ingress of liquids, such as water vapor, or gases from the ambient air into the pulsating heat pipe

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Implementation Method 5

heat can be transported from the connecting element to the heat sink into which heat from the connecting element is to be dissipated

Methodology Applied
Scientific EffectHeat sink: Heat Sink

Data Source

PatentEP4379794B1Pulsating heat pipe support device, power module, and computer program product
Publication Date: 2025.01.29 SIEMENS AG
  • EP4379794B1 patent drawingFigure 1
  • EP4379794B1 patent drawingFigure 2
  • EP4379794B1 patent drawingFigure 3

AI summary

The invention relates to a support device (10) for mechanically supporting an electrically conductive connecting element (12) to be cooled on a heat sink (14). The support device (10) electrically insulates the connecting element (12) from the heat sink (14). According to the invention, the support device (10) incorporates at least one pulsating heat tube (30) to cool the connecting element (12) into the heat sink (14). The invention further relates to a power module (50) equipped with at least one such support device (10). The invention also relates to a computer program (60) designed to simulate the operating behavior of such a support device (10).