Pulse Laser Scanning Synchronization for Continuous Hole Drilling
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Solution Overview
Problem
Existing laser processing methods for forming through holes in workpieces require multiple irradiations of the same portion, leading to a reduced effective laser irradiation rate due to wasted laser energy during movement of the processing head or workpiece.
Innovation Solution
A laser processing method where the workpiece is irradiated with pulse laser that has passed through an optical scanning device, with the scanning device changing the position of irradiation from an initial to a terminal position and back, while the processing head moves in the opposite direction at a matching speed, ensuring continuous irradiation of the same portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the processing head and workpiece are stopped to form through holes, then the holes can be formed accurately, but the effective laser irradiation rate is lowered due to wasted laser energy during movement
Solution Approach 1:
The patent maintains continuous laser irradiation during the entire processing cycle by synchronizing the movement of the processing head with the optical scanning. The laser continues to irradiate the workpiece while the processing head moves, eliminating idle laser energy waste that occurs when the system stops and starts repeatedly. This achieves both accurate hole formation and high effective laser irradiation rate.
Solution Approach 2:
The patent introduces dynamic synchronization between the processing head movement and optical scanning. The processing head moves at a controlled speed while the optical scanning device adjusts its scanning speed to match, creating a dynamic system where the laser position relative to the workpiece remains controlled throughout continuous motion. This dynamic approach replaces the static stop-start method.
2Adaptability or versatility
If the processing head moves to change the irradiated portion, then different areas can be processed, but laser energy is wasted during the movement transition
Solution Approach 1:
The patent ensures the laser continuously irradiates the workpiece surface during processing head movement by synchronizing the optical scanning with the head's motion. The optical scanning device adjusts its scanning speed to match the processing head's movement speed, ensuring the laser beam remains positioned correctly on the workpiece throughout the transition, eliminating energy waste during area changes.
3Reliability
If multiple irradiations are performed on the same portion, then through holes can be formed in difficult-to-process workpieces, but the effective laser irradiation rate decreases
Solution Approach 1:
The patent enables continuous laser irradiation on the same workpiece portion for multiple passes by maintaining synchronized movement between the processing head and optical scanning. The laser continuously irradiates the target area while the system moves and returns, allowing multiple irradiations without stopping. This eliminates the energy waste associated with repeated stopping and starting, achieving both reliable hole formation and high effective irradiation rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves a higher effective laser irradiation rate by allowing multiple holes to be formed in the same portion without stopping the processing head, thereby optimizing energy usage.
Implementation Method 1
The optical scanning device scans with the pulse laser, so that a phenomenon in which a position of irradiation with the pulse laser sequentially changes from an initial position to a terminal position at a scanning speed and then returns to the initial position is periodically repeated
Implementation Method 2
the workpiece set at the processing position is irradiated with pulse laser that has been emitted from a processing head and has passed through an optical scanning device, to form plural holes in the workpiece
Data Source
AI summary
A laser processing method includes a preparation step and a processing step. In the preparation step, a workpiece (100), which is a processing object, is set at a processing position. In the processing step, the workpiece (100) set at the processing position is irradiated with pulse laser that has been emitted from a processing head (13) and has passed through an optical scanning device, to form plural holes in the workpiece (100). The optical scanning device scans with the pulse laser, so that a phenomenon in which a position of irradiation with the pulse laser sequentially changes from an initial position to a terminal position at a scanning speed and then returns to the initial position is periodically repeated. In the processing step, a position of irradiating the workpiece with the pulse laser is changed in a direction opposite to scanning with the pulse laser by the optical scanning device and at a speed substantially equal to a speed of the scanning with the pulse laser by the optical scanning device, whereby substantially the same portion of the workpiece (100) is irradiated with the pulse laser corresponding to one period.