Pulse Loop Heat Exchanger With Multi-Plane Channels for Leak-Tight Cooling
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Solution Overview
Problem
Pulse loop heat exchangers face challenges in achieving consistent thermal performance due to manufacturing complexity, leak tightness issues, and fluid flow inefficiencies, which affect their ability to efficiently dissipate heat in electronic systems.
Innovation Solution
The design incorporates a pulse loop heat exchanger with channels and grooves on different elevated plane levels, enhancing thermo-fluidic transport through increased output pressure gain and oscillation driving forces, and a manufacturing method involving aluminum extrusion and stamping to ensure consistency and sealing without increasing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional manufacturing methods are used for pulse loop heat exchangers, then manufacturing simplicity is maintained, but manufacturing precision and leak tightness are poor
Solution Approach 1:
The heat exchanger is divided into multiple separate channels, each manufactured independently using extrusion or stamping processes. These channels are then assembled and joined together to form the complete heat exchanger structure. This segmentation allows each component to be manufactured with high precision using standardized processes, ensuring leak-tight joints while maintaining overall manufacturing simplicity through modular assembly.
2Reliability
If complex manufacturing methods are used to improve sealing, then leak tightness is improved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is designed to be self-service through standardized extrusion and stamping operations that automatically produce consistent, precision-formed channels. The modular design allows components to be self-assembled through simple joining operations, eliminating the need for complex manual sealing procedures while ensuring reliable leak-tight connections through repeatable manufacturing processes.
3Productivity
If channels are placed on the same plane, then manufacturing simplicity is maintained, but thermo-fluidic transport efficiency is reduced
Solution Approach 1:
The channel structure transitions from a two-dimensional single-plane arrangement to a three-dimensional multi-plane configuration. Channels are positioned on different elevated planes within the heat exchanger body, creating vertical and horizontal pathways that enhance fluid circulation and heat transfer efficiency. This dimensional expansion improves thermo-fluidic transport without significantly increasing manufacturing complexity, as the multi-plane structure can be integrated into the extrusion or stamping process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal performance by boosting oscillation driving forces and reducing the risk of fluid loss, resulting in more efficient heat dissipation and improved reliability in electronic systems.
Implementation Method 1
The heat exchanger body and first continuity plate and second continuity plate comprise a plurality of channels and grooves on different elevated plane levels, respectively, thereby increasing an output pressure gain in downward working fluid flow portions of the grooves and boosting oscillation driving forces throughout the pulse loop heat exchanger
Implementation Method 2
Pulse loop heat exchangers are vacuum containers that carry heat from a heat source by evaporation of a working fluid which is spread by a vapor flow filling the vacuum
Implementation Method 3
The vapor flow eventually condenses over cooler surfaces, and, as a result, the heat is distributed from an evaporation surface (heat source interface) to a condensation surface (larger cooling surface area)
Implementation Method 4
The pulse loop heat exchanger is formed by an aluminum extrusion and stamping process
Data Source
AI summary
A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate and second continuity plate comprise a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. The second continuity plate comprises a second continuity plate attachment surface having a third elevated continuity channel. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.