Pulsed Coolant Flow for Process Chamber Component Thermal Control
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Solution Overview
Problem
Rapid cooling of process chamber components can cause damage due to thermal stress, leading to increased downtime and decreased efficiency in substrate processing systems.
Innovation Solution
A method involving reduced power to heaters and a pulsed coolant flow with a duty cycle to control the cooling rate of process chamber components, ensuring they reach a temperature just above the coolant temperature before ceasing coolant flow, thereby preventing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If rapid cooling is applied to process chamber components, then cooling time is reduced and productivity is improved, but thermal stress damages components with different coefficients of thermal expansion
Solution Approach 1:
The patent applies periodic action by using pulsed coolant flow instead of continuous flow. The coolant is delivered in controlled pulses with specific duty cycles (e.g., 10% to 50%), creating periodic cooling action that allows thermal equilibrium to be maintained between bonded components, preventing thermal stress while still achieving efficient cooling.
Solution Approach 2:
The patent implements dynamics by making the coolant flow rate variable rather than constant. The system dynamically adjusts the coolant flow based on real-time temperature measurements of the component, using feedback control to modify the duty cycle of pulsed flow. This dynamic adjustment allows the cooling rate to adapt to the thermal state of different components, preventing thermal shock while maintaining cooling efficiency.
2Reliability
If manual stepwise coolant temperature increase is used to prevent thermal stress, then component damage is prevented, but labor intensity increases and cooling efficiency decreases
Solution Approach 1:
The patent applies self-service by implementing an automated feedback control system that continuously monitors component temperature and automatically adjusts coolant flow parameters without human intervention. The system uses temperature sensors and control algorithms to self-regulate the cooling process, eliminating the need for manual operation while ensuring component integrity.
Solution Approach 2:
The patent implements feedback control by using temperature sensors to continuously monitor the thermal state of process chamber components and using this information to automatically adjust coolant flow rate and duty cycle. The control system compares measured temperatures with target values and modifies cooling parameters in real-time, creating a closed-loop system that prevents thermal stress while maintaining operational simplicity.
3Productivity
If continuous coolant flow is used for cooling, then cooling efficiency is high, but thermal stress damages bonded components
Solution Approach 1:
The patent applies periodic action by replacing continuous coolant flow with pulsed flow delivery. The coolant is supplied in periodic pulses with controlled duty cycles, creating intervals of cooling action followed by brief pauses. This periodic pattern allows thermal equilibrium to be maintained between bonded components during the pause intervals, preventing thermal stress on bonding materials while still achieving efficient overall cooling through the active cooling phases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for controlled cooling of process chamber components, preventing damage and reducing downtime, while maintaining efficiency in substrate processing systems.
Implementation Method 1
a heater disposed proximate a surface of the process chamber component to reduce an amount of heat provided to the component by the heater
Implementation Method 2
providing a coolant to coolant channels disposed within the process chamber component
Implementation Method 3
flowing a coolant through the coolant channels to remove heat from the process chamber component
Implementation Method 4
when the component is cooled too rapidly, the component may incur damage. For example, when cooling a two piece showerhead having multiple parts (e.g. a body and faceplate) with different coefficients of thermal expansion coupled together via a bonding material, rapid cooling of the showerhead may unduly strain or stress the bonding material
Data Source
AI summary
Methods for cooling process chamber components are provided herein. In some embodiments, a method of cooling a process chamber component may include reducing a power provided to a heater disposed proximate a surface of the process chamber component to reduce an amount of heat provided to the component by the heater; providing a coolant to coolant channels disposed within the process chamber component using a pulsed flow having a duty cycle until the process chamber component reaches a temperature that is less than or equal to a predetermined magnitude above a temperature of the coolant; and after the process chamber component reaches the temperature less than or equal to the predetermined magnitude above a temperature of the coolant, reducing the duty cycle of the pulsed flow of the coolant to zero.