Pulsed Resistance Heating Carrier for Uniform Thermal Processing
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Solution Overview
Problem
Existing electronics processing methods face challenges such as irreversible material damage and inefficiency due to high temperatures, and the formation of byproducts that interfere with uniform processing, particularly in curing high-temperature polymers like polyimide.
Innovation Solution
A carrier system with an electrically conductive heating layer (ECL) that uses pulsed resistance heating to generate localized, controlled heat pulses, allowing materials to be heated above steady-state thresholds briefly without sustained damage, and includes a dielectric material to stabilize the carrier and support structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high temperatures are used for processing electronics structures, then processing efficiency and performance are improved, but materials are susceptible to irreversible damage and failure
Solution Approach 1:
The patent applies periodic pulsed heating cycles where the heating layer is heated to high temperatures for short durations to process the electronics structure, then cooled below damage thresholds. This periodic heating and cooling allows the material to withstand high temperatures temporarily for processing while preventing irreversible damage through adequate cooling periods, thereby resolving the contradiction between processing efficiency and material integrity.
2Manufacturing precision
If sustained high-temperature processing is used, then processing is thorough, but significant amounts of sustained energy are required which is inefficient and costly
Solution Approach 1:
The patent uses periodic pulsed heating instead of sustained heating, where the heating layer is heated to high temperatures only for the brief duration necessary to achieve the processing objective, then cooled. This approach maintains processing completeness while dramatically reducing overall energy consumption compared to continuous high-temperature processing, resolving the contradiction between manufacturing precision and energy efficiency.
3Manufacturing precision
If high-temperature processing is used for curing polyimide, then curing can be achieved, but byproducts form that interfere with processing and prevent uniform layer formation
Solution Approach 1:
The patent employs periodic pulsed heating cycles that heat the heating layer to high temperatures for curing polyimide while allowing cooling periods in between. This periodic action prevents byproducts from accumulating to interfering levels, as the cooling periods allow byproducts to dissipate or decompose, thereby achieving uniform curing without the harmful effects of sustained high-temperature processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables rapid, efficient thermal processing with reduced energy consumption and minimizes material damage by maintaining average temperatures below maximum thresholds while achieving uniform curing and controlled crystallinity, facilitating the production of high-quality thin films and multilayer devices.
Implementation Method 1
The first resistance heating current passage is configured to generate heat via current passed through the first resistance heating current passage
Data Source
AI summary
A carrier for temporarily carrying an electronics structure for thermal processing and corresponding system and methods for using the same. The carrier includes an electrically conductive layer (“ECL”) that defines at least one current path through which a current can travel. The carrier is configured to be connected to a current source so pulsed current is passed through the current path to generate heat in a working area of the carrier. The carrier is configured to carry an electronics structure near the working area. When the current source is used to generate heat in the carrier, thermal processing of the electronics structure is performed. A temperature of the electronics structure and the carrier is regulated by controlling the intensity, duration, and period of the pulsed current.