Pulsed Laser Machining with Adaptive Focused Pulse Sequences

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Solution Overview

Problem

Conventional ablation and separation methods using ultrashort laser pulses face challenges in achieving high process throughput and optimal cut or trench geometry, with existing methods relying on constant energy deposition and limited spatial optimization of laser energy.

Innovation Solution

A method involving a sequence of laser pulses synchronized with the fundamental frequency of the laser, where each sequence comprises at least two different sequence elements offset in space and time, with specific properties such as focal position and pulse energy adapted for each element, allowing for precise spatial and temporal control of energy deposition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional ablation methods use constant energy deposition at fixed time intervals, then the machining process is simple to control, but the cut geometry quality and process throughput are limited

Engineering Contradiction:
Improvecut geometry qualityVSAvoidcontrol complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The laser pulse sequence is segmented into multiple sequence elements (individual pulses, pulse trains, or bursts) with different properties. Each sequence element can have customized parameters including focal position, pulse energy, and temporal spacing, allowing precise control of energy deposition at different locations to achieve complex cut geometries while maintaining manageable control through modular sequencing

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system dynamically adapts sequence element properties during machining. The focal position is varied for each sequence element to optimize energy deposition at different depths and locations. The pulse energy and temporal spacing are also dynamically adjusted based on the machining stage and material response, enabling high-quality cut geometry through real-time parameter optimization

Inventive Principle:
Principle #15Dynamics

2Productivity

If high laser powers are used for machining, then the process throughput increases, but the energy deposition becomes difficult to optimize spatially

Engineering Contradiction:
Improveprocess throughputVSAvoidenergy deposition optimization
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

Different sequence elements are assigned different focal positions tailored to specific spatial requirements. Individual pulses or pulse trains within a sequence can be focused at different depths and lateral positions, allowing high power to be delivered precisely where needed while maintaining optimal energy distribution throughout the workpiece volume for high throughput machining

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The laser operates in periodic pulse sequences with synchronized timing to the fundamental laser frequency. Multiple sequence elements are delivered in repeating patterns that allow high average power processing while maintaining precise temporal control. The periodic structure enables consistent energy deposition across large areas, achieving both high throughput and spatial optimization

Inventive Principle:
Principle #19Periodic action

3Manufacturing precision

If the laser focus position is fixed, then the system is simpler to operate, but the machining precision and adaptability to different features are reduced

Engineering Contradiction:
Improvemachining precisionVSAvoidsystem operation simplicity
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The machining process is divided into sequence elements, each with its own optimized focal position. This segmentation allows the system to achieve high machining precision by focusing energy appropriately for each specific feature or depth zone, while the automated sequencing maintains ease of operation through programmatic control rather than manual adjustment

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The focal position parameter is systematically varied across different sequence elements to optimize machining at different locations and depths. The system automatically manages these parameter changes through pre-programmed sequences, maintaining ease of operation while achieving high precision through dynamic focal position adaptation

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables precise machining geometry and material modification, reducing pulse energy needs while achieving high process throughput and optimizing energy deposition for complex ablation and separation processes.

Implementation Method 1

method for machining a material by means of laser pulses of a pulsed laser

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

energy is deposited in the material at different positions

Methodology Applied
Scientific EffectAbsorption of electromagnetic radiation: Absorption (EM radiation)

Data Source

PatentUS20230211438A1Method for machining a material
Publication Date: 2023.07.06 TRUMPF LASER & SYSTEMTECHNIK GMBH
  • US20230211438A1 patent drawing
  • US20230211438A1 patent drawing
  • US20230211438A1 patent drawing

AI summary

A method for machining a material using a pulsed laser includes introducing a sequence of laser pulses into the material for machining the material, and synchronizing a start of each sequence with a fundamental frequency of the laser. The sequence of laser pulses comprises at least two different sequence elements that are offset from one another in space and time. Each sequence element comprises an individual laser pulse, a specific succession of individual laser pulses, or a burst of laser pulses. Specific sequence element properties are impressed on each sequence element. The sequence element properties comprise a position of the laser focus of a respective sequence element. The position of the laser focus of each sequence element of the sequence is adapted for each sequence element.