Pulsed Laser Cutting Transparent Substrates Curved Paths

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Solution Overview

Problem

Current methods for cutting transparent and semitransparent substrates, such as glass, face challenges in achieving precise and efficient cutting of intricate shapes and small features due to limitations in CO2 laser processing, particularly with curved paths and small radii of curvature.

Innovation Solution

A pulsed laser system is used to create micro-fractures within the substrate by adjusting the power profile and polarization of the laser signal, allowing for deterministic separation of the substrate into desired shapes, including straight lines and curved cuts, without the need for consumable materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If CO2 laser processing is used for cutting glass substrates, then straight-line and large-radius curve cutting can be achieved, but intricate shapes, small holes, and small-radius curves cannot be effectively cut

Engineering Contradiction:

Improvecutting precision for intricate shapes and small featuresVSAvoidability to cut various shapes including small holes and curved lines

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent employs pulsed laser processing instead of continuous CO2 laser processing. The periodic pulsed action allows the laser to create micro-fractures at controlled intervals, enabling precise cutting of intricate shapes, small holes, and curved lines with radii as small as 5mm, thereby resolving the limitation of CO2 lasers that could only handle straight lines and large-radius curves

Inventive Principle:

Principle #19Periodic action

Solution Approach 2:

The patent changes the laser processing parameters by using ultrashort pulsed lasers with specific pulse durations (femtosecond to picosecond range) and repetition rates (1kHz to 1MHz). These parameter changes enable the laser to interact with the glass substrate in a fundamentally different way, creating micro-fractures rather than melting or vaporizing the material, thus achieving precision cutting of complex geometries

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If mechanical processing is used for fabricating glass substrates, then various geometric features can be formed, but consumable materials are required and the process is labor intensive and time consuming

Engineering Contradiction:

Improveprocess simplicity and reduced labor intensityVSAvoidconsumable material usage and environmental impact

Core Design Contradiction:

Ease of manufactureVSLoss of substance

Solution Approach 1:

The patent replaces mechanical cutting tools and consumables with a pulsed laser system that creates micro-fractures in the glass substrate. This non-contact, non-mechanical process eliminates the need for blades, abrasives, and other consumable materials, while also reducing labor intensity and processing time, directly addressing both contradictions

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If pulsed laser systems are used for creating sub-surface modification features, then linear path cutting is achieved, but curved paths with small radii of curvature cannot be effectively cut

Engineering Contradiction:

Improvecutting accuracy for linear pathsVSAvoidability to cut curved paths with small radii

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent uses high-repetition-rate pulsed lasers (1kHz to 1MHz) that create densely spaced micro-fractures along the cutting path. This periodic action with optimized pulse spacing enables the laser to follow curved trajectories with small radii of curvature (as small as 5mm) while maintaining cutting precision, overcoming the limitation of traditional pulsed laser systems that were restricted to linear paths

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables precise and efficient cutting of transparent and semitransparent substrates with minimal post-processing requirements, improving accuracy and reducing environmental impact by eliminating the need for consumables and enhancing throughput.

Implementation Method 1

A pulsed laser system is used to create micro-fractures within the substrate by adjusting the power profile and polarization of the laser signal

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

A pulsed laser system is used to create micro-fractures within the substrate by adjusting the power profile and polarization of the laser signal

Methodology Applied

Scientific EffectThermal stress: Thermal Shock

Data Source

PatentUS10179374B2Method and apparatus for laser cutting transparent and semitransparent substrates

Publication Date: 2019.01.15 NEWPORT CORP

AI summary

The present application is directed to a method and apparatus for processing a transparent or semitransparent material with a laser beam resulting in deterministic separation of a single sheet of the material into two or more pieces.