Pulsed Light Soldering Control for Thermal Capacity Variation
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Solution Overview
Problem
In surface mount technology, existing soldering techniques face challenges in optimizing soldering conditions and improving productivity due to variations in thermal capacity and temperature of electronic devices.
Innovation Solution
A soldering device equipped with a pulsed light irradiator and a control unit that predicts the final rise temperature of electronic devices based on light pulse power, weight, temperature, and exposure parameters, allowing for real-time adjustments to pulse power, width, or irradiation period to maintain optimal temperature ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If intense pulsed light is used for soldering electronic devices, then soldering speed and productivity are improved, but temperature control becomes difficult due to variations in thermal capacity
Solution Approach 1:
The system dynamically adjusts light pulse parameters (power, width, period) in real-time based on the electronic device's thermal capacity and current temperature, transforming a static soldering process into an adaptive one that maintains optimal temperature control while preserving high-speed soldering benefits
Solution Approach 2:
The patent changes multiple light pulse parameters (power, time width, period) simultaneously to optimize both soldering speed and temperature control, allowing the system to adapt to different electronic device thermal capacities without sacrificing productivity
2Productivity
If light pulse power is increased to improve soldering efficiency, then productivity increases, but the risk of overheating and damage to electronic devices increases
Solution Approach 1:
The system incorporates temperature sensing and control unit feedback that continuously monitors the electronic device's temperature and adjusts light pulse parameters accordingly, creating a closed-loop control system that prevents overheating while maintaining high soldering efficiency
Solution Approach 2:
The patent uses periodic pulsed light irradiation with controlled duty cycles, allowing the electronic device to cool between pulses while receiving sufficient total energy for efficient soldering, thereby reducing peak temperature exposure and overheating risk
3Device complexity
If fixed light pulse parameters are used for soldering, then device complexity is reduced, but soldering quality deteriorates due to inability to adapt to thermal capacity variations
Solution Approach 1:
The control unit automatically determines optimal light pulse parameters based on the electronic device's characteristics and thermal capacity, eliminating the need for manual parameter adjustment and making the system self-adapting while maintaining soldering quality consistency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures consistent and efficient soldering by maintaining electronic devices within a specific temperature range, improving the bonding process and reducing the risk of overheating, thereby enhancing the mechanical strength and reliability of the soldered connections.
Implementation Method 1
at least one pulsed light irradiator configured to irradiate intense pulsed light (IPL) to a workpiece including an electronic device
Data Source
AI summary
A soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result. A soldering method includes calculating power of the light pulse based on a time width of the light pulse, measuring a temperature of the electronic device, and predicting a final rise temperature of the electronic device, based on the calculated power, a weight of the electronic device, the measured temperature, the quantity of exposures of the light pulse, and the irradiation period.