Centrifugal Pump Circuit Board Thermal Coupling
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Solution Overview
Problem
Centrifugal pumps with electronic components face challenges in heat dissipation due to low heat conductance of component housings and difficulty in ensuring flat support, requiring additional cooling solutions and increased installation space.
Innovation Solution
The electronic circuit board conductors are in direct heat conducting contact with the base, utilizing a heat sink like the split case base for efficient heat dissipation, with heat conducting elements such as foils and strategically designed conductor cross-sections and surface expansions to enhance thermal coupling, and employing open drillings for optimal heat discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electronic components are mounted on a circuit board in a conventional centrifugal pump housing, then the pump can be manufactured with standard components, but the heat dissipation efficiency is poor due to low heat conductance of the housing material
Solution Approach 1:
The patent merges the circuit board mounting function with the heat dissipation function by integrating the circuit board directly into the pump housing structure. The housing base serves dual purposes: structural support and heat sink. This eliminates the need for separate cooling bodies while maintaining manufacturing simplicity.
Solution Approach 2:
The pump housing base is designed to serve multiple functions simultaneously: it provides mechanical support for the circuit board, acts as a heat sink for thermal management, and maintains the structural integrity of the pump. This multi-functionality resolves the contradiction by making the housing both easy to manufacture and effective at heat dissipation.
2Temperature
If additional cooling bodies are added to improve heat dissipation, then heat management efficiency increases, but the device complexity and installation space requirements increase
Solution Approach 1:
The circuit board is integrated directly into the housing structure, eliminating the need for separate cooling bodies. The housing base itself serves as the heat dissipation medium, reducing component count and simplifying the overall device while maintaining effective heat management.
Solution Approach 2:
The pump housing automatically serves its own cooling needs by utilizing the circulation medium that already flows through the pump. The housing base acts as a self-contained heat sink, eliminating the requirement for additional active cooling systems or separate cooling components.
3Ease of operation
If the circuit board is positioned away from the housing base, then component installation is easier, but thermal coupling efficiency decreases
Solution Approach 1:
The circuit board is merged with the housing base through direct thermal contact, ensuring optimal heat transfer from the electronic components to the housing structure. This integration maintains ease of installation while maximizing thermal coupling efficiency.
Solution Approach 2:
The housing base is designed with specific local characteristics to enhance thermal coupling at the circuit board contact area. The base provides a thermally conductive path directly beneath the circuit board, ensuring efficient heat dissipation while maintaining simple installation procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively discharges heat to the pump's circulation medium, reducing the need for additional cooling bodies and minimizing installation space, while ensuring efficient heat management for heat-sensitive components.
Implementation Method 1
one or more conductors of the electronic circuit board are in heat conducting contact with the base. Electronic components pass on the heat generated in them first to the conductors connected to them directly; bringing these conductors in heat conducting contact with a heat sink can be very effective. The heat sink in this context is the base of the split case.
Implementation Method 2
A particularly advantageous method is to arrange the heat conducting element fitting the surface of the conductors and the base between the base and the conductors. This arrangement ensures an exceptional heat discharging effect by virtue of the fact that the heat originating in an electronic component is discharged to the circulation medium of the centrifugal pump through the conductors of the electronic circuit board, the heat conducting medium and the base of the split case.
Data Source
AI summary
A centrifugal pump with an existing pump housing made of plastic material that can be processed through injection molding, the pump housing having a first housing section featuring a suction nozzle and a pressure nozzle, a second housing section supporting an electronically commutated DC motor and a split case, a motor housing section that closes a dry chamber separated from a wet chamber by the split case in which a stator and electronic components are arranged, and a permanent magnet rotor that is mounted in the wet chamber in such a way that it can rotate, thereby driving a pump impeller that reaches into the pump chamber. The electronic components are arranged on an electronic circuit board parallel to a base of the split case. The electronic circuit board is in heat conducting contact with the base.