Centrifugal Pump Coil Layout for Compact Cooling and Vibration Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Centrifugal pumps require a disproportionate amount of space due to the size of electronic components, leading to increased manufacturing costs and installation challenges in confined spaces.
Innovation Solution
A centrifugal pump design with a printed circuit board and coil arrangement using a spacing device that keeps the coil at a distance from the circuit board, allowing additional components to be stacked, and thermally connects the coil to the housing for improved heat transfer and fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are arranged on a circuit board in a centrifugal pump, then the pump can be controlled, but the housing dimensions increase disproportionately
Solution Approach 1:
The patent applies vertical stacking of electronic components above the circuit board instead of arranging them only in the planar dimension. The coil is positioned above the circuit board at a distance, and capacitors are stacked vertically, utilizing the third dimension (height) to reduce the horizontal footprint and overall housing volume.
Solution Approach 2:
The patent implements nesting by placing the coil above the circuit board with the capacitor positioned between them, creating a nested vertical arrangement. The spacing device with legs provides structural support for this nested configuration, allowing multiple components to occupy overlapping horizontal spaces at different vertical levels.
2Adaptability or versatility
If the housing is dimensioned larger to accommodate electronic components, then all components fit, but manufacturing costs increase
Solution Approach 1:
By transitioning from two-dimensional planar arrangement to three-dimensional vertical stacking, the patent reduces the required housing footprint. This dimensional change allows standard-sized housings to accommodate all electronic components without requiring oversized custom housings, thereby reducing manufacturing costs.
3Volume of moving object
If electronic components are densely packed, then space is optimized, but heat dissipation becomes insufficient
Solution Approach 1:
The patent introduces a spacing device with legs as an intermediary structure between the circuit board and the coil. This spacing device creates vertical separation that enables heat to dissipate upward toward the housing interior space, while still allowing dense horizontal packing of components. The legs of the spacing device provide thermal pathways and air circulation channels.
4Volume of moving object
If the coil is placed close to the circuit board, then space is saved, but the coil becomes sensitive to vibrations
Solution Approach 1:
The spacing device with legs acts as a vibration-isolating intermediary between the coil and the circuit board. The legs provide mechanical support while creating damping distance, reducing the transmission of vibrations from the pump environment to the sensitive coil and electronic components.
Solution Approach 2:
The patent extracts the coil from direct contact with the circuit board by positioning it above the spacing device. This separation removes the coil from the vibration-prone environment near the circuit board mounting points, isolating it from mechanical stresses while maintaining electrical connectivity.
5Adaptability or versatility
If additional electronic components are added, then functionality increases, but the circuit board area required increases
Solution Approach 1:
The patent resolves the area constraint by moving additional electronic components (coil, capacitor) from the two-dimensional circuit board plane into the third vertical dimension. This allows the circuit board to maintain a compact area while supporting enhanced functionality through vertically stacked components above and below it.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a more compact pump with reduced material costs, enhanced heat dissipation, and increased resistance to vibrations, enabling efficient use in confined spaces.
Implementation Method 1
the coil is spaced from the printed circuit board in such a way that the top side of the coil is thermally connected to the housing on the inside
Data Source
Figure 1
Figure 2
AI summary
The invention relates to a centrifugal pump (1) comprising a motor (4) for pumping a fluid and a housing (2), wherein a printed circuit board (3), a coil (11) (4) having a bottom and a top (13) and an electronically conductively connected coil (11) (4) having a bottom and a top (13), and a spacer device (8) arranged on the printed circuit board (3) are provided in the housing (2), the bottom of the coil (11) is arranged on the spacer device (8) and the coil (11) is spaced apart from the printed circuit board (3), and the top (13) of the coil (11) is thermally connected to the housing (2).