Pump-Driven Fin Array Heat Transfer System to Eliminate External Fans
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional vapor compression refrigeration cycles require external fans for enhanced heat transfer, which are not efficient in height-constrained spaces and consume excessive power, necessitating an improvement in heat transfer systems.
Innovation Solution
A heat transfer system comprising a first and second fin array with centrifugal pumps and heat transfer layers, where the second fluid flow path is serpentine and thermally isolated by a separator layer, allowing for efficient heat transfer between fluids without external fans, and potentially integrating a compressor and expansion valve for a refrigeration cycle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If external fans are used to enhance heat transfer on the external side of heat exchangers, then heat transfer efficiency is improved, but power consumption increases and the system becomes unsuitable for height-constrained spaces
Solution Approach 1:
The patent removes the external fan component from the heat transfer system. Instead of using mechanical fans to force air circulation, the system relies on natural convection currents and the integrated pump-driven fluid circulation to achieve heat transfer, thereby eliminating the power consumption associated with external fans while maintaining heat transfer efficiency
Solution Approach 2:
The heat transfer system is designed to be self-sufficient by utilizing natural convection principles and the refrigerant circulation system's own pump to drive heat transfer. The integrated fin array and heat transfer layers work together with the circulating fluid to create self-sustaining heat exchange without requiring additional external power sources
2Productivity
If external fans are used to enhance heat transfer, then heat transfer efficiency is improved, but the system becomes unsuitable for height-constrained spaces
Solution Approach 1:
The patent integrates the fin array directly with the heat transfer layers to form a unified heat exchange structure. This merging of components eliminates the need for separate external fan assemblies and their associated vertical space requirements, making the system compact and suitable for height-constrained applications while maintaining effective heat transfer surface area
Solution Approach 2:
The system transitions from a vertically-oriented heat exchanger design (requiring height for fan placement and air intake/exhaust paths) to a horizontally-integrated design where heat transfer occurs through layered structures. This dimensional reconfiguration allows the system to achieve the same heat transfer efficiency without the vertical space previously required for fan-based systems
3Reliability
If traditional separate evaporator and condenser heat exchangers are used, then heat transfer function is achieved, but device complexity and packaging efficiency are reduced
Solution Approach 1:
The patent combines the evaporator and condenser heat exchanger functions into a single integrated heat transfer assembly. The first and second heat transfer layers with their respective fin arrays work together as a unified structure, reducing the number of separate components, simplifying the overall system architecture, and improving packaging efficiency while maintaining reliable heat transfer functionality
Solution Approach 2:
The integrated heat transfer assembly serves multiple functions simultaneously - the first heat transfer layer handles evaporator functions while the second heat transfer layer handles condenser functions, and both are connected through the refrigerant circulation system. This multi-functional design reduces device complexity by eliminating the need for completely separate heat exchanger assemblies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves efficient heat transfer with reduced power consumption and compact design, suitable for height-constrained applications, offering fan-power savings and improved packaging efficiency.
Implementation Method 1
a first pump disposed in fluid communication with the first fin array and configured to cause a first fluid to flow through the first fin array
Implementation Method 2
The first heat transfer layer and the first fin array can be configured to cause heat transfer between the first fluid and the second fluid
Implementation Method 3
a separator layer can be attached on a first side to the first heat transfer layer to thermally isolate the first heat transfer layer from a second side of the separator layer
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A heat transfer system (100) (e.g., a heat pump) includes at least a first fin array (101) and at least a first pump (103) disposed in fluid communication with the first fin array and configured to cause a first fluid to flow through the first fin array. The system includes at least a first heat transfer layer (105) attached to and/or in thermal communication with the first fin array. The first heat transfer layer defines a second fluid flow path therein for a second fluid to flow fluidly isolated from the first fluid. The first heat transfer layer and the first fin array are configured to cause heat transfer between the first fluid and the second fluid.