Pump Insert Thermal Bridge for Heat Dissipation
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Solution Overview
Problem
Existing pump arrangements for vehicles lack effective thermal management, leading to inefficiencies in heat dissipation and potential performance issues due to inadequate heat transfer mechanisms.
Innovation Solution
A pump arrangement with a receiving housing and a pump insert featuring a mounting structure that forms a thermal bridge, utilizing heat-conducting elements and cooling fins to dissipate heat generated by control electronics, and a design that allows for efficient heat transfer between the mounting structure and the receiving housing, enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional pump arrangements are used without thermal management features, then the device complexity is reduced and ease of manufacture is improved, but heat dissipation efficiency deteriorates leading to performance issues
Solution Approach 1:
The mounting structure serves dual functions: mechanically securing the pump insert to the receiving housing while simultaneously acting as a thermal bridge for heat dissipation. This integration eliminates the need for separate cooling components, resolving the contradiction between improved temperature management and reduced device complexity
Solution Approach 2:
The mounting structure is designed as a multi-functional component that provides both structural support (mechanical attachment) and thermal management (heat conduction pathway). This universal design allows a single component to address multiple requirements, improving heat dissipation without proportionally increasing device complexity
2Temperature
If thermal management features are added to the pump arrangement, then heat dissipation efficiency is improved, but manufacturing complexity and cost increase
Solution Approach 1:
By combining the thermal bridge function with the existing mounting structure, the invention avoids adding separate cooling components. The mounting structure is modified to include heat-conducting materials or geometric features that facilitate heat transfer, maintaining manufacturing simplicity while achieving effective thermal management
Solution Approach 2:
The mounting structure's material properties or geometric parameters are modified to enhance thermal conductivity. This could involve selecting materials with higher thermal conductivity or designing the mounting structure with increased surface area contact, achieving improved thermal management through parameter optimization rather than adding complex cooling systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated during operation, improving the thermal management of the pump arrangement and maintaining efficient performance by transferring heat from control electronics to the mounting structure and further into the receiving housing, thereby enhancing overall heat management.
Implementation Method 1
heat-conducting elements to dissipate heat generated by control electronics
Implementation Method 2
cooling fins to dissipate heat generated by control electronics
Implementation Method 3
cooling fins to dissipate heat generated by control electronics
Implementation Method 4
mounting structure that forms a thermal bridge, utilizing heat-conducting elements
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
Pump insert (1) for arrangement in a receiving space (104), wherein the pump insert (1) comprises a pump (10) with a pump chamber and a conveying element rotatable about an axis of rotation, which is arranged in the pump chamber, an electric motor (20) with a rotor rotatable about the axis of rotation and a stator, and a drive shaft rotatably mounted about the axis of rotation, wherein the rotor and the conveying element are connected via the drive shaft in such a way that a rotation of the rotor causes a rotation of the conveying element.