Pump Insert Thermal Bridge for Heat Dissipation

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Solution Overview

Problem

Existing pump arrangements for vehicles lack effective thermal management, leading to inefficiencies in heat dissipation and potential performance issues due to inadequate heat transfer mechanisms.

Innovation Solution

A pump arrangement with a receiving housing and a pump insert featuring a mounting structure that forms a thermal bridge, utilizing heat-conducting elements and cooling fins to dissipate heat generated by control electronics, and a design that allows for efficient heat transfer between the mounting structure and the receiving housing, enhancing thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional pump arrangements are used without thermal management features, then the device complexity is reduced and ease of manufacture is improved, but heat dissipation efficiency deteriorates leading to performance issues

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The mounting structure serves dual functions: mechanically securing the pump insert to the receiving housing while simultaneously acting as a thermal bridge for heat dissipation. This integration eliminates the need for separate cooling components, resolving the contradiction between improved temperature management and reduced device complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mounting structure is designed as a multi-functional component that provides both structural support (mechanical attachment) and thermal management (heat conduction pathway). This universal design allows a single component to address multiple requirements, improving heat dissipation without proportionally increasing device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If thermal management features are added to the pump arrangement, then heat dissipation efficiency is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvethermal management efficiencyVSAvoidease of manufacture
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

By combining the thermal bridge function with the existing mounting structure, the invention avoids adding separate cooling components. The mounting structure is modified to include heat-conducting materials or geometric features that facilitate heat transfer, maintaining manufacturing simplicity while achieving effective thermal management

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mounting structure's material properties or geometric parameters are modified to enhance thermal conductivity. This could involve selecting materials with higher thermal conductivity or designing the mounting structure with increased surface area contact, achieving improved thermal management through parameter optimization rather than adding complex cooling systems

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat generated during operation, improving the thermal management of the pump arrangement and maintaining efficient performance by transferring heat from control electronics to the mounting structure and further into the receiving housing, thereby enhancing overall heat management.

Implementation Method 1

heat-conducting elements to dissipate heat generated by control electronics

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

cooling fins to dissipate heat generated by control electronics

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

cooling fins to dissipate heat generated by control electronics

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 4

mounting structure that forms a thermal bridge, utilizing heat-conducting elements

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3879105B1Pump insert and pump assembly comprising such a pump insert
Publication Date: 2024.10.23 SCHWABISCHE HUTTENWERKE AUTOMOTIVE CMBH
  • EP3879105B1 patent drawingFigure 1
  • EP3879105B1 patent drawingFigure 2~3
  • EP3879105B1 patent drawingFigure 4~5

AI summary

Pump insert (1) for arrangement in a receiving space (104), wherein the pump insert (1) comprises a pump (10) with a pump chamber and a conveying element rotatable about an axis of rotation, which is arranged in the pump chamber, an electric motor (20) with a rotor rotatable about the axis of rotation and a stator, and a drive shaft rotatably mounted about the axis of rotation, wherein the rotor and the conveying element are connected via the drive shaft in such a way that a rotation of the rotor causes a rotation of the conveying element.