Pump Motor Substrate Layout for Vibration-Resistant Solder Joints
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Solution Overview
Problem
The existing configuration of fixing a substrate to a housing with a single screw position leads to substrate deflection under external vibration, causing large stress on soldered terminals and potentially resulting in conduction failure due to the mass of elements mounted on the substrate.
Innovation Solution
The substrate is fixed to the housing at two positions, with the distance between the maximum mass element and the closest fixing part being shorter than the distance between the soldered terminal and the fixing part, reducing substrate deflection and stress on soldered parts, and the maximum mass element is positioned on a virtual line connecting the two fixing parts to minimize deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the substrate is fixed to the housing at one position, then the fixing structure is simple, but the substrate deflects under external vibration causing stress on soldered terminals
Solution Approach 1:
The single fixing point is segmented into multiple fixing points (two or more positions). This distributes the mechanical stress and reduces substrate deflection under vibration, preventing solder crack while maintaining structural simplicity through modular fixing arrangements
2Stability of the object's composition
If two fixing parts are provided to reduce substrate deflection, then substrate stability improves, but the moment of force on heavy elements increases causing large deformation at terminal-soldered parts
Solution Approach 1:
The fixing parts are strategically positioned based on the distribution of elements on the substrate. Heavy elements like capacitors are placed closer to fixing parts to reduce the moment of force, while terminal-soldered parts are positioned in regions with smaller deformation amounts, creating non-uniform but optimized stress distribution across the substrate
3Adaptability or versatility
If heavy elements are mounted on the substrate, then the device functionality is complete, but the moment of force under vibration increases causing solder crack
Solution Approach 1:
The layout strategy positions heavy elements (capacitors) and terminal-soldered parts in relation to fixing parts to create a balanced configuration. By controlling the relative positions and distances, the moment of force generated by heavy elements is counteracted, reducing stress concentration on solder joints while maintaining required device functionality
Data Source
AI summary
In a motor of the pump device, a substrate includes a first terminal-soldered part to which a winding-wire terminal is connected and a second terminal-soldered part to which a connector terminal is connected. The substrate is fixed to the housing at two positions with a first fixing part and a second fixing part. When the distance between a first electric element, which is a maximum mass element having the largest mass on the substrate, and the second fixing part, which is a proximal fixing part closest to the first electric element among the two fixing parts, is taken as a first distance, and the distance between the proximal fixing part and a proximal soldering part closest to the proximal fixing part among multiple first terminal-soldered parts and multiple second terminal-soldered parts is taken as a second distance, the first distance is smaller than the second distance.