Electric Pump PCB Layout for Compact Size and Heat Dissipation

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Solution Overview

Problem

The existing electric pump designs face challenges with increased size along the motor's rotation axis and elevated temperatures of the printed circuit board and electronic components due to their arrangement.

Innovation Solution

The electric pump design positions the printed circuit board close to the impeller housing, using a conductive pin for electrical connection, and incorporates a potting resin to seal and dissipate heat efficiently, allowing heat transfer to the fluid flowing through the impeller chamber, thus minimizing size and temperature increases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the printed circuit board is arranged at the side of the motor housing portion, then the electrical connection between the coil and the printed circuit board is facilitated, but the size of the electric pump increases in the rotation axis direction of the motor

Engineering Contradiction:
Improveelectrical connectionVSAvoidsize in rotation axis direction
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The printed circuit board is repositioned from the motor housing side to the impeller housing side, utilizing the radial dimension of the impeller housing rather than extending in the axial dimension. This dimensional shift allows electrical connection while avoiding axial length increase.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The printed circuit board is nested within the impeller housing portion, specifically in the discharge side chamber, utilizing existing internal space rather than adding external volume. This nesting approach accommodates the PCB without increasing overall pump dimensions.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of manufacture

If the printed circuit board is arranged near the coil, then the electrical connection is simplified, but the temperature of the printed circuit board and electronic parts increases

Engineering Contradiction:
Improveelectrical connectionVSAvoidtemperature of printed circuit board
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The printed circuit board is extracted from the vicinity of the motor coil, removing it from the high-temperature zone. By relocating the PCB to the impeller housing side, the harmful thermal influence from the coil is eliminated while electrical connection is maintained through strategic positioning near the discharge side.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The impeller housing discharge side chamber serves as an intermediary space that facilitates electrical connection between the motor coil and the printed circuit board without requiring direct proximity. This intermediate zone allows connection while providing thermal separation.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Length of moving object

If the printed circuit board is positioned to reduce size, then the compactness is improved, but the temperature management becomes more challenging

Engineering Contradiction:
Improvesize in rotation axis directionVSAvoidtemperature of electronic parts
Core Design Contradiction:
Length of moving objectVSTemperature

Solution Approach 1:

The high-temperature fluid discharged from the impeller chamber is converted into a beneficial cooling medium for the printed circuit board. By positioning the PCB in the discharge side chamber, the hot fluid flow serves to dissipate heat from electronic components, transforming a potential harmful factor into a useful thermal management mechanism.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the size increase along the motor's rotation axis and suppresses the temperature rise of the printed circuit board and electronic components, enhancing the pump's compactness and thermal management.

Implementation Method 1

incorporates a potting resin to seal and dissipate heat efficiently, allowing heat transfer to the fluid flowing through the impeller chamber

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentEP3540239B1Electrically driven pump
Publication Date: 2023.11.01 SHINANO KENSHI CO LTD
  • EP3540239B1 patent drawingFigure 1A~1B
  • EP3540239B1 patent drawingFigure 2
  • EP3540239B1 patent drawingFigure 3A~3B

AI summary

An electric pump includes: a motor; an impeller rotated by the motor; a motor housing portion that houses the motor; an impeller housing portion that houses the impeller and is positioned at one side with respect to the motor housing portion in a rotation axis of the motor; an introduction pipe portion that introduces a fluid into the impeller housing portion and is positioned at the one side with respect to the motor housing portion; a discharge pipe portion that discharges the fluid from the impeller housing portion; a printed circuit board electrically connected to a coil of the motor and positioned at the one side with respect to the motor housing portion; and an electronic part mounted on the printed circuit board, wherein the printed circuit board faces the impeller housing portion and is positioned at the one side with respect to the impeller.