Pump Enclosure Pillar Housing for Fanless Control Circuit Cooling

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Solution Overview

Problem

Traditional pump enclosures with external control circuitry mounting increase weight and footprint, requiring cooling fans to prevent overheating, which increases power consumption and can disrupt clean room environments.

Innovation Solution

A pump enclosure design featuring detachable pillars with interconnected extrusions that house control circuitry, providing a robust and thermally conductive housing to minimize footprint and dissipate heat without the need for air cooling fans, using thermally conductive materials like aluminum for the extrusions and incorporating heat exchange mechanisms.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If control circuitry is mounted externally on the pump enclosure, then the spacing from heat source is maximized, but the footprint and weight increase

Engineering Contradiction:

Improvecontrol circuitry temperatureVSAvoidpump enclosure footprint

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The control circuitry housing is nested within the hollow interior of the pillar structure. The pillar serves as both a structural support element and an integrated housing for the control circuitry, eliminating the need for separate external mounting enclosures and reducing overall footprint while maintaining thermal spacing through the pillar's wall thickness.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The pillar is designed to perform multiple functions simultaneously: providing structural support for the pump enclosure, housing the control circuitry within its hollow interior, and acting as a heat sink through its thermally conductive material. This multi-functionality consolidates components and reduces the overall footprint.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Area of stationary object

If control circuitry is mounted internally within the pump enclosure, then the footprint is reduced, but heat dissipation becomes problematic

Engineering Contradiction:

Improvepump enclosure footprintVSAvoidcontrol circuitry temperature

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

The walls of the hollow pillar interior serve as a thermal intermediary between the pump heat source and the control circuitry. The thermally conductive material of the pillar acts as a heat sink, absorbing and dissipating heat away from the control circuitry while allowing close proximity mounting, thus enabling internal mounting without overheating issues.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If cooling fans are used for control circuitry, then heat dissipation is improved, but power consumption increases

Engineering Contradiction:

Improvecontrol circuitry temperatureVSAvoidpower consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The pillar structure serves itself as a passive heat sink for the control circuitry through its inherent thermally conductive material properties. No active cooling components like fans are required, as the pillar's material naturally conducts heat away from the control circuitry, eliminating additional power consumption while maintaining effective heat dissipation.

Inventive Principle:

Principle #25Self-service

4Temperature

If cooling fans are used for control circuitry, then heat dissipation is improved, but air disturbance occurs

Engineering Contradiction:

Improvecontrol circuitry temperatureVSAvoidair disturbance

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The mechanical cooling system (fans) is replaced with a passive thermal conduction system using the thermally conductive pillar material. This substitution eliminates moving parts and air flow generation, thereby eliminating air disturbance in sensitive environments while still achieving effective heat dissipation through thermal conduction.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces the pump enclosure's footprint, protects control circuitry from heat and external damage, and maintains control circuitry temperatures within a safe range, eliminating the need for cooling fans and minimizing environmental disruption.

Implementation Method 1

By forming the extrusions from thermally conductive material, the pillar can provide at least part of a heat sink for dissipating heat generated by the pump during use

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

at least one of the extrusions may be profiled to receive a water cooling circuit, for example at least one pipe through which coolant fluid passes, in use, so that heat can be transferred from the pillar to water flowing in the pipe

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS7850261B2Pump enclosure

Publication Date: 2010.12.14 EDWARDS LTD

AI summary

A pump enclosure includes a base, a plurality of pillars, and a cover. One of the pillars includes interconnecting aluminium extrusions defining therebetween a housing for pump control circuitry. This pillar can also provide a heat sink for dissipating heat generated during use of a pump away from the control circuitry.